松香基聚酰胺在各向同性导电胶中的应用

CIESC Journal

松香基聚酰胺在各向同性导电胶中的应用

林贵福，聂小安，米桢

中国林业科学研究院林产化学工业研究所；生物质化学利用国家工程实验室；国家林业局林产化学工程重点开放性实验室，江苏南京 210042

出版日期:2011-05-05 发布日期:2011-06-13

Application of rosin–based polyamide in isotopic conductive adhesive

LIN Guifu，NIE Xiaoan，MI Zhen

Institute of Chemical Industry of Forest Products，Chinese Academy of Forestry；National Engineering Lab. for Biomass Chemical Utilization；Key and Open Lab. of Forest Chemical Engineering，State Forestry Administration，Nanjing 210042，Jiangsu，China

Online:2011-05-05 Published:2011-06-13

摘要/Abstract

摘要：

以马来海松酸酐、二乙烯三胺为原料，合成了松香基聚酰胺，并以其为固化剂，以环氧树脂618为导电胶基体，Ag包Cu粉为导电胶填料，KH560、聚乙二醇（200）为促进剂，制备了Ag包Cu粉导电胶，讨论了各因素对导电胶剪切强度、导电性能的影响，并测定了导电胶的玻璃化温度及耐热性能。结果表明，环氧树脂与松香基聚酰胺在固化质量比为100∶50.8、120 ℃/60 min 条件下可完全固化；Ag包Cu粉的添加量为环氧树脂质量的60%、KH560、聚乙二醇添加量分别为Ag包Cu粉质量的3%、5%时，导电胶的综合性能最优，此时，导电胶的热分解温度为342.1 ℃，玻璃化温度为144.7 ℃。

Abstract:

Rosin-based polyamide used as curing agent for conductive adhesive，was prepared from maleopimaric acid anhydride by amidation with diethylenetriamine，with epoxy resin 618 as matrix，silver-coated copper powder as conductive filler，KH560 and PEG（200）as accelerant，and silver-coated copper powder conductive adhesive was prepared. The influences of various factors on the shear strength，conductivity of the conductive adhesive were discussed，and its glass transition and heat-resistance were evaluated. The result showed that the resin epoxy/rosin-based polyamide system was cured completely when the mass ratio of resin epoxy：rosin-based polyamide was 100∶50.8 at 120 ℃ for 60 min，and the addition of silver-coated copper powder was 60% to resin epoxy，KH560 and PEG（200）were 3% and 5% to silver-coated copper powder respectively.Under such conditions the comprehensive performance of the conductive adhesive was optimal. Thermal decomposition temperature was 342.1 ℃，and glass transition was 144.7 ℃.

林贵福，聂小安，米桢. 松香基聚酰胺在各向同性导电胶中的应用 [J]. CIESC Journal.

LIN Guifu，NIE Xiaoan，MI Zhen. Application of rosin–based polyamide in isotopic conductive adhesive[J]. .