热适应复合材料应用于电子器件散热的研究进展

尹辉斌，高学农，丁静，张正国

Advances in application of thermal adaptation composite materials in electronic device cooling

YIN Huibin，GAO Xuenong，DING Jing，ZHANG Zhengguo

CIESC Journal . 2007, (6): 830 .