高热通量下热电器件热结构耦合数值模拟

吴永佳, 明廷臻, 彭柯源, 沈文庆

Thermodynamics and thermal stress analysis of TEG under high heat flux condition

WU Yongjia, MING Tingzhen, PENG Keyuan, SHEN Wenqing

化工学报 . 2014, (S1): 303 -307 . DOI: 10.3969/j.issn.0438-1157.2014.z1.049