端部热导分配对半导体器件制冷性能的影响

邱华辰, 郝俊红, 任建勋

Influence on performance of thermoelectric cooling devices of thermal conductance distribution between hot and cold ends

Huachen QIU, Junhong HAO, Jianxun REN

化工学报 . 2020, (S2): 39 -45 . DOI: 10.11949/0438-1157.20200590