化工学报 ›› 2012, Vol. 63 ›› Issue (2): 335-349.DOI: 10.3969/j.issn.0438-1157.2012.02.001

• 综述与专论 •    下一篇

界面接触热阻的研究进展

张平 李强 宣益民   

  1. 南京理工大学能源与动力工程学院
  • 收稿日期:2010-11-24 修回日期:2011-11-09 出版日期:2012-02-05 发布日期:2012-02-05
  • 通讯作者: 张平

The Development of Thermal Contact Resistance

ZHANG Ping, XUAN Yimin, LI Qiang   

  1. School of Energy and Power Engineering , Nanjing University  of Science &  Technology
  • Received:2010-11-24 Revised:2011-11-09 Online:2012-02-05 Published:2012-02-05

摘要: 界面接触热阻(TCR)是电子器件冷却、低温超导薄膜等领域研究中的一个热点。综合评述了对接触热阻的传热机理的研究方法、测量方法以及减小接触热阻的主要措施,介绍了近年来国内外对接触热阻的最新研究成果和进展,现有的研究表明:对于界面接触热阻这一特殊物理问题,其理论研究既要从宏观上定量分析又要在微观上综合考虑声子、电子的散射、辐射等机理;在实验方面,目前的测量精度不够高,实验测量工作有待进一步地完善;在减小接触热阻方面,除了常用的方法外,可以通过在接触表面生长新型的高性能导热材料(碳纳米管等)来实现。对已报道的研究工作进行了总结,指出了今后的研究方向。

关键词: 接触热阻, 微纳米尺度传热, 电子散热, 接触热导

Abstract: Thermal contact resistance (TCR) has been a hot topic in electronics cooling and cryogenic superconducting thin films etc. In this paper, the fundamental research method, metrology macro- and nanotechnology and the diminishing method of TCR were discussed. The reported research suggests that in order to investigate the mechanism of TCR, the scattering and radiation of phonon and electron should be considered besides the quantitative analysis in macro. In the experiment, the current measurement accuracy is not perfect enough, the experimental work remains to be further improved. For reducing the contact resistance, in addition to the commonly used methods, producing new high-performance thermal conductivity materials (such as carbon nano-tubes) on the contact surface is a useful way. Based on summarizing the reported studies, the future research directions are pointed out.

Key words: thermal contact resistance, micro scale heat transfer theory, electronics heat dissipating, thermal contact conductance

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