TG-siloxane改性BPFER/mXDA体系固化反应动力学与热性能

doi:10.3969/j.issn.0438-1157.2013.06.025

化工学报 ›› 2013, Vol. 64 ›› Issue (6): 2080-2085.DOI: 10.3969/j.issn.0438-1157.2013.06.025

• 催化、动力学与反应器 • 上一篇下一篇

TG-siloxane改性BPFER/mXDA体系固化反应动力学与热性能

宋秋生, 姚伟, 杨森森, 徐蕤

合肥工业大学化学工程学院,安徽合肥 230009

收稿日期:2012-09-18 修回日期:2013-02-02 出版日期:2013-06-05 发布日期:2013-06-05
通讯作者: 宋秋生(1963—),男,博士,教授。
作者简介:宋秋生(1963—),男,博士,教授。
基金资助:
广东省教育部产学研合作项目(2010QSKJ0711)。

Curing kinetics and thermal properties of TG-siloxane modified BPFER/mXDA system

SONG Qiusheng, YAO Wei, YANG Sensen, XU Rui

School of Chemical Engineering, Hefei University of Technology, Hefei 230009, Anhui, China

Received:2012-09-18 Revised:2013-02-02 Online:2013-06-05 Published:2013-06-05
Supported by:
supported by the Cooperative Research Projects of Enterprise of Guangdong Province and University Operated Directly under the Ministry of Education of China(2010QSKJ0711).

摘要/Abstract

摘要： 以1,3-二氨丙基-1,1,3,3-四甲基二硅氧烷(DSX)和环氧氯丙烷(ECH)为原料,利用相转移催化剂,合成双酚F环氧树脂(BPFER)改性剂N,N,N',N'-四缩水甘油基-1,3-二氨丙基-1,1,3,3-四甲基二硅氧烷(TG-siloxane),并用FTIR、¹³C NMR谱图对其结构进行了表征。对TG-siloxane改性BPFER/mXDA(间苯二甲胺)体系的固化动力学进行了研究。根据DSC曲线和Starink方程,得该体系表观固化活化能为51.52 kJ·mol^-1。用Šesták-Berggren模型求得不同升温速率下的表观因子、反应级数。动力学方程表明,升温速率对固化反应影响明显;所得方程用于预估反应进程时,与实测值吻合程度高。TG分析表明,TG-siloxane改性BPFER/mXDA体系固化物的耐热性能优于单纯BPFER/mXDA固化物。

关键词: 固化反应动力学, 差示扫描量热法, 耐热性, 双酚F环氧树脂, 有机硅改性剂

Abstract: N,N,N',N'-tetraglycidyl -1,3 - diamino-propyl-1,1,3,3-tetramethyl disiloxane (TG-siloxane) was synthesized by using phase transfer catalyst and was characterized with FTIR and ¹³C NMR. The kinetics of curing reaction for a system of bisphenol F epoxy resin (BPFER) /TG-siloxane with m-xylylenediamine (mXDA) as curing agent was monitored with differential scanning calorimetry (DSC).The apparent activation energy was obtained by the Starink equation.The kinetic parameters, such as frequency factor and the values of reaction order were obtained based on the Šesták-Berggren model.The kinetic equation suggested that the curing reaction was influenced greatly by heating rate.It was shown that the predicted reaction progress was very close to the experiment.The TG curves indicated that cured BPFER/TG-siloxane/mXDA system had better heat-resistance than that of BPFER/mXDA.

Key words: curing reaction kinetics, differential scanning calorimetry, heat-resistance, bisphenol F epoxy resin, silicon modifier

中图分类号:

V255

宋秋生, 姚伟, 杨森森, 徐蕤. TG-siloxane改性BPFER/mXDA体系固化反应动力学与热性能[J]. 化工学报, 2013, 64(6): 2080-2085.

SONG Qiusheng, YAO Wei, YANG Sensen, XU Rui. Curing kinetics and thermal properties of TG-siloxane modified BPFER/mXDA system[J]. CIESC Journal, 2013, 64(6): 2080-2085.

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TG-siloxane改性BPFER/mXDA体系固化反应动力学与热性能

Curing kinetics and thermal properties of TG-siloxane modified BPFER/mXDA system

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