电沉积锡基复合镀层的可焊性

CIESC Journal

电沉积锡基复合镀层的可焊性

唐致远,郭鹤桐,檀立新

天津大学应用化学系,天津大学应用化学系,天津大学应用化学系天津300072 ,天津300072 ,天津300072

出版日期:1993-12-25 发布日期:1993-12-25

SOLDERABILITY OF ELECTRO - DEPOSITED TIN-BASED COMPOSITE COATING

Tang Zhiyuan,Guo Hetong and Tan Lixin (Dept. of Applied Chemistry, Tianjin University, Tianjin 300072)

Online:1993-12-25 Published:1993-12-25

摘要/Abstract

摘要： 研究了在镀液中加入TUM系列添加剂的锡基复合镀层的可焊性,这种锡基复合镀层的3秒润湿力已接近理论润湿力值.研究了多种内在因素(表面氧化膜、“锡疫”)对镀层可焊性的影响.采用X-射线衍射、离子探针等分析仪器对镀层的微观结晶形态、表面氧化进行了分析,并探讨了复合微粒影响镀层可焊性的作用机理.

Abstract: Solderability of tin - based composite coating was studied by adding TUM series of additives to the soldering bath. The 3 second wetting force of the composite coating almost reached the theoretical value, with its solderability approaching the best level. The effect of inner factors (surface oxidic film, "tin pest")on solderability was investigated. The microcrys-talline structure and surface oxidation were examined with X - ray diffraction and ion probe, and the mechanism of the effect of composite particles on solderability was studied.

唐致远,郭鹤桐,檀立新. 电沉积锡基复合镀层的可焊性 [J]. CIESC Journal.

Tang Zhiyuan,Guo Hetong and Tan Lixin (Dept. of Applied Chemistry, Tianjin University, Tianjin 300072). SOLDERABILITY OF ELECTRO - DEPOSITED TIN-BASED COMPOSITE COATING[J]. .