CIESC Journal

• 材料科学与工程 • 上一篇    下一篇

自修复聚合物材料用微胶囊

田薇;王新厚;潘强;毛志平   

  1. 东华大学纺织学院;东华大学化工学院,上海 200051

  • 出版日期:2005-06-25 发布日期:2005-06-25

Microcapsule used for self-healing polymer material

TIAN Wei;WANG Xinhou;PAN Qiang;MAO Zhiping

  

  • Online:2005-06-25 Published:2005-06-25

Abstract: Microcapsules with dicyclopentadiene(DCPD) as core material and urea formaldehyde resin as wall material used for making self-healing polymer material were prepared with the in-situ polymerization method.The effect of microcapsules on the fracture toughness of epoxy resin was studied.The addition of microcapsules into epoxy resin results in the decrease of fracture toughness.When microcapsule content was kept constant,as the microcapsule size increased the fracture toughness of the epoxy resin decreased linearly and the percentage of decrease compared to the neat epoxy without microcapsules increased linearly.Moreover, the fracture toughness of the material decreases linearly with the increase of microcapsule content.