Ni-W-P镀层的防垢性能

CIESC Journal

Ni-W-P镀层的防垢性能

王跃峰，侯峰，徐宏，夏翔鸣，曾斌

华东理工大学机械与动力工程学院化学工程联合国家重点实验室，上海200237

出版日期:2011-11-05 发布日期:2011-11-21

Antiscaling property investigation on electroless Ni-W-P composite coating

WANG Yuefeng，HOU Feng，XU Hong，XIA Xiangming，ZENG Bin

State Key Laboratory of Chemical Engineering ，School of Mechanical and Power Engineering，East China University of Science and Technology，Shanghai 200237，China

Online:2011-11-05 Published:2011-11-21

摘要/Abstract

摘要：

在紫铜基体上制备了化学镀Ni-W-P镀层，X射线衍射结果表明，镀层的结构形态为非晶态。污垢附着实验和池沸腾实验结果表明，低表面自由能的化学镀Ni-W-P镀层使污垢沉积速度降低了52%，在硫酸钙溶液中的传热系数则是紫铜表面的1.7倍。用高速摄影仪观察了沸腾表面的气泡行为，由于传热方式的差别形成了两种不同结构的硫酸钙污垢，紫铜表面为针状垢，而镀层表面是粒状垢。

Abstract:

A piece of electroless Ni-W-P composite coating was prepared on copper substrates. X-ray diffraction results show the coating has an amorphous structure. The results of adhesion test and pool boiling experiment all indicate that the scale adhesion speed on the electroless Ni-W-P coating with lower surface free energy is reduced by 52%，the average value of heat transfer coefficient is 1.7 times that of plain copper surface when boiling in calcium sulphate solution. The bubble behavior on boiling surface was captured by a high speed camera. Depending on the heat transfer mechanism，two different types of deposits have been observed. A needle-like structure is the characteristic of scale formed on a plain copper surface，while a granular structure corresponds to the scale formed on the Ni–W–P coating surface.

王跃峰，侯峰，徐宏，夏翔鸣，曾斌. Ni-W-P镀层的防垢性能[J]. CIESC Journal.

WANG Yuefeng，HOU Feng，XU Hong，XIA Xiangming，ZENG Bin. Antiscaling property investigation on electroless Ni-W-P composite coating[J]. .