CIESC Journal

• 资源与环境工程 • 上一篇    下一篇

Ni-W-P镀层的防垢性能

王跃峰,侯 峰,徐 宏,夏翔鸣,曾 斌   

  1. 华东理工大学机械与动力工程学院化学工程联合国家重点实验室,上海200237
  • 出版日期:2011-11-05 发布日期:2011-11-21

Antiscaling property investigation on electroless Ni-W-P composite coating

WANG Yuefeng,HOU Feng,XU Hong,XIA Xiangming,ZENG Bin   

  1. State Key Laboratory of Chemical Engineering ,School of Mechanical and Power Engineering,East China University of Science and Technology,Shanghai 200237,China
  • Online:2011-11-05 Published:2011-11-21

摘要:

在紫铜基体上制备了化学镀Ni-W-P镀层,X射线衍射结果表明,镀层的结构形态为非晶态。污垢附着实验和池沸腾实验结果表明,低表面自由能的化学镀Ni-W-P镀层使污垢沉积速度降低了52%,在硫酸钙溶液中的传热系数则是紫铜表面的1.7倍。用高速摄影仪观察了沸腾表面的气泡行为,由于传热方式的差别形成了两种不同结构的硫酸钙污垢,紫铜表面为针状垢,而镀层表面是粒状垢。

Abstract:

A piece of electroless Ni-W-P composite coating was prepared on copper substrates. X-ray diffraction results show the coating has an amorphous structure. The results of adhesion test and pool boiling experiment all indicate that the scale adhesion speed on the electroless Ni-W-P coating with lower surface free energy is reduced by 52%the average value of heat transfer coefficient is 1.7 times that of plain copper surface when boiling in calcium sulphate solution. The bubble behavior on boiling surface was captured by a high speed camera. Depending on the heat transfer mechanismtwo different types of deposits have been observed. A needle-like structure is the characteristic of scale formed on a plain copper surfacewhile a granular structure corresponds to the scale formed on the Ni–W–P coating surface.