Abstract: The coating of Ni-P/Ni-Cu-P on the surface of Kevlar fiber was achieved by electroless plating. The surface appearance and composition of original sample,coarsened sample,plated sample and spalled coating were investigated and compared by means of SEM,EDS and XRD.In addition,the formation mechanism and spalling reason of the coating was studied.The results showed that the Kevlar fiber specific surface area,hydrophilicity and activity increased after chemical pretreatment.After chemical Ni-P/Ni-Cu-P plating,the content of Ni in Ni-P coating decreased,however,the content of P increased,Ni was transformed into Ni₃P and a little Cu was discovered in Ni-P coating.The atomic proportions of Ni,Cu,P in overall coating were 8.54:3.66:5.59,the phase of the coating mostly consisted of Cu,Cu₃P and Ni₃P.Because the stress of coating distributed unequally and P gathered partly in Ni-P/Ni-Cu-P phase interface,the interface bonding strength was weakened and local stress concentration occurred,which appeared to be the reason for spalling of the coating.The chemical Cu plating relied on the catalytic action of nickel ions,which helped deposition of copper ions to form the coating.

Key words: Kevlar fibers, electroless Ni-P/Ni-Cu-P plating, nanograin, spalled coating, catalytic action

摘要： 采用化学镀技术,实现了芳纶纤维表面化学镀Ni-P/Ni-Cu-P的金属化处理,利用SEM、EDS和XRD分别对芳纶纤维原始样品、粗化后、施镀后及剥落层的表面形貌、镀层的成分和物相进行了分析比较,并对镀层的形成机制及剥落原因进行了分析研究。结果表明:经过预处理的芳纶纤维比表面积增大,增加了其亲水性和活性;化学镀Ni-P/Ni-Cu-P后,Ni-P镀层中镍含量降低,磷含量增多,纯镍转化为Ni₃P且伴随有少量的铜的出现,整体镀层中Ni、Cu、P的原子比为8.54:3.66:5.59,镀层中以纯Cu、Cu₃P和Ni₃P为主;另外由于镀层中应力分布不均,以及P在Ni-P/Ni-Cu-P相界面的偏聚,削弱了界面的结合强度,使局部拉应力集中,造成了镀层的剥落;且化学镀铜是依靠镍离子的催化作用形成镀层的。

关键词: 芳纶纤维, 化学镀Ni-P/Ni-Cu-P, 纳米晶, 剥落层, 催化作用