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A model for predicting plating thickness during citrate alkaline copper-electroplating process

FU Limin,CHAI Xinsheng,HU Lixin,ZHAN Wen   

  • Online:2010-11-05 Published:2010-11-05

新型柠檬酸碱性镀铜工艺中镀层厚度的预测模型

付丽敏,柴欣生,胡立新,占稳   

  1. 华南理工大学制浆造纸工程国家重点实验室;湖北工业大学化学与环境工程学院

Abstract:

A model for predicting the plating thickness during the citrate alkaline electroplating process was proposed. It was based on the relationships between the coating thickness of copper and electroplating time at different current densities in a given citrate alkaline medium. The results showed a good agreement between the coating thickness data predicted by the present model and the data measured experimentally. Based on the model, an equation was established for calculating the current efficiencies during the process. Such data would be valuable for the process control and optimization during citrate alkaline copper-electroplating.

摘要:

研究了不同电流密度下柠檬酸碱性镀铜过程中镀层厚度随电镀时间的变化规律。在对镀层成分、阴极极化曲线等分析的基础上建立了该工艺条件下镀层厚度的预测模型。结果表明:该模型对镀层厚度的预测值与实测值之间有很好的相关性,可准确地预测不同电流密度、电镀时间下的镀层厚度。基于该模型还建立了该电镀过程中电流效率与相关工艺参数的数学关系。这些将为柠檬酸碱性镀铜的生产实践提供很好的指导。