×
模态框（Modal）标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框（Modal）标题
×
Fig/Tab
Rss
Email Alert
Adv Search
Home
About Journal
Editorial Board
Publishing Ethics
Subscriptions
Advertise
Contact Us
Download
中文
Introduction
Indexed-in
Journal Metrics
A model for predicting plating thickness during citrate alkaline copper-electroplating process
FU Limin
,CHAI Xinsheng
,HU Lixin
,ZHAN Wen
CIESC Journal . 2010, (
11
): 2906 -2911 .
