含石蜡@二氧化硅纳米胶囊和碳纤维的相变热界面材料及其散热性能

doi:10.11949/0438-1157.20221420

化工学报 ›› 2023, Vol. 74 ›› Issue (4): 1795-1804.DOI: 10.11949/0438-1157.20221420

• 材料化学工程与纳米技术 • 上一篇下一篇

含石蜡@二氧化硅纳米胶囊和碳纤维的相变热界面材料及其散热性能

尹驰¹(), 张正国¹^,²^,³, 凌子夜¹^,², 方晓明¹^,²()

^1.华南理工大学传热强化与过程节能教育部重点实验室，广东广州 510640
^2.广东省热能高效储存与利用工程技术研究中心，广东广州 510640
^3.华南理工大学珠海现代产业创新研究院，广东珠海 519175

收稿日期:2022-10-28 修回日期:2023-02-27 出版日期:2023-04-05 发布日期:2023-06-02
通讯作者: 方晓明
作者简介:尹驰（1998—），女，硕士研究生，1848981266@qq.com
基金资助:
国家重点研发计划项目(2020YFA0210704)

Combining paraffin@silica nanocapsules with carbon fiber to develop a phase change thermal interface material for efficient heat dissipation

Chi YIN¹(), Zhengguo ZHANG¹^,²^,³, Ziye LING¹^,², Xiaoming FANG¹^,²()

^1.Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, South China University of Technology, Guangzhou 510640, Guangdong, China
^2.Guangdong Engineering Technology Research Center of Efficient Heat Storage and Application, South China University of Technology, Guangzhou 510640, Guangdong, China
^3.South China University of Technology-Zhuhai Institute of Modern Industrial Innovation, Zhuhai 519175, Guangdong, China

Received:2022-10-28 Revised:2023-02-27 Online:2023-04-05 Published:2023-06-02
Contact: Xiaoming FANG

摘要/Abstract

摘要：

含有相变材料的热界面材料（即相变热界面材料）可借助相变材料的吸热来直接缓解高热通量对芯片造成的冲击。将相变胶囊与导热填料复配引入聚合物基料有望获得可靠性好的相变热界面材料。将石蜡@二氧化硅纳米胶囊与碳纤维复配，制备了一系列含不同质量分数碳纤维和纳米相变胶囊的聚二甲基硅氧烷基相变热界面材料样品，测定了它们的相变特性、热导率和硬度，并将它们分别用于模拟芯片散热来评价其应用性能。结果表明，碳纤维含量的增大致使相变热界面材料样品的热导率和硬度上升，而纳米相变胶囊含量的上升带来相变热界面材料的熔化焓上升及硬度下降，从而都对相变热界面材料的散热性能产生影响。石蜡@二氧化硅纳米胶囊和碳纤维的协同作用致使在所有制备的样品中纳米胶囊含量34%（质量）和碳纤维含量9%（质量）的相变热界面材料取得了最佳散热性能。此外，该相变热界面材料还具有优异的热可靠性，因而具备应用前景。

关键词: 相变热界面材料, 纳米胶囊, 碳纤维, 聚二甲基硅氧烷, 芯片散热

Abstract:

Thermal interface materials containing phase change materials, namely phase change thermal interface materials (PCTIMs), can directly relieve the impact of high heat flux on chip through the heat absorption. Incorporating phase change capsules and thermally conductive fillers into polymeric matrix is expected to develop the PCTIMs with good thermal reliability. In this work, the paraffin@silica nanocapsules were synthesized, followed by combining with carbon fiber, to develop polydimethylsiloxane based PCTIMs. A series of the PCTIMs were fabricated at different loadings of the nanocapsules and carbon fiber, and their phase change characteristics, thermal conductivity and hardness were measured, followed by evaluating their performance for chip heat dissipation. It is found that, the increase in mass fraction of carbon fiber resulted in the increment in both thermal conductivity and hardness for the PCTIMs, while the increase in mass fraction of the paraffin@silica nanocapsules resulted in the increment in latent heat as well as the decrease in hardness for the PCTIMs, all of which influenced the heat dissipation performance of the PCTIMs. The synergistic effects between the paraffin@silica nanocapsules and the carbon fiber make the PCTIM containing 34%(mass) of the nanocapsules and 9%(mass) of the carbon fiber achieve the best heat dissipation performance among all the prepared PCTIM samples. Moreover, the optimal PCTIM also exhibited excellent thermal reliability, thus showing potential in practical applications.

Key words: phase change thermal interface materials, nanocapsules, carbon fiber, polydimethylsiloxane, chip heat dissipation

中图分类号:

TB 34

尹驰, 张正国, 凌子夜, 方晓明. 含石蜡@二氧化硅纳米胶囊和碳纤维的相变热界面材料及其散热性能[J]. 化工学报, 2023, 74(4): 1795-1804.

Chi YIN, Zhengguo ZHANG, Ziye LING, Xiaoming FANG. Combining paraffin@silica nanocapsules with carbon fiber to develop a phase change thermal interface material for efficient heat dissipation[J]. CIESC Journal, 2023, 74(4): 1795-1804.

图/表 12

图1 PA@SiO2纳米胶囊(a)和PA@SiO2/CF/PDMS PCTIM (b)的制备流程示意图

Fig.1 Schematic diagram for preparing PA@SiO2 nanocapsules (a) and PCTIM (b)

表1 PCTIM样品中各组分的质量分数

Table 1 Mass fractions of the components in the PCTIMs

样品	PA@SiO₂/%	CF/%	PDMS/%
18Ne-6CF	18	6	76
18Ne-8CF	18	8	74
18Ne-9CF	18	9	73
18Ne-10CF	18	10	72
26Ne-6CF	26	6	68
26Ne-8CF	26	8	66
26Ne-9CF	26	9	65
26Ne-10CF	26	10	64
34Ne-6CF	34	6	60
34Ne-8CF	34	8	58
34Ne-9CF	34	9	57
34Ne-10CF	34	10	56

图2 评价PCTIM散热性能的实验装置示意图

Fig.2 Experimental set-up for evaluating heat dissipation performance of PCTIM

图3 PA@SiO2纳米胶囊的SEM (a)和TEM (b)图像以及PA、SiO2和PA@SiO2纳米胶囊的FT-IR (c)和XRD (d)谱图

Fig.3 SEM (a) and TEM (b) images of PA@SiO2 nanocapsules, together with FT-IR spectra (c) and XRD patterns (d) of PA, SiO2 and PA@SiO2 nanocapsules

图4 PA以及PA@SiO2经历过100次冷热循环前后的DSC曲线

Fig.4 DSC curves of PA and the PA@SiO2 nanocapsules before and after experiencing 100 heating-cooling cycles

表2 PA以及PA@SiO2纳米胶囊的相变特性

Table 2 Phase change characteristics of PA and PA@SiO2 nanocapsules

样品	T_m/℃	T_f/℃	H_m/(J/g)	H_f/(J/g)
PA	69.70	71.38	192.8	180.1
PA@SiO₂	68.98	73.77	136.0	134.2
PA@SiO₂（100th）	69.15	73.79	135.0	134.1

图5 含不同质量分数CF和纳米胶囊的PDMS基PCTIM样品横截面SEM照片

Fig.5 Cross-section SEM images of the PDMS based PCTIM samples containing different mass fractions of CF and PA@SiO2 nanocapsules

图6 CF、PA@SiO2纳米胶囊、PDMS和PCTIM（34Ne-9CF）的FT-IR谱图

Fig.6 FT-IR spectra of CF, PA@SiO2 nanocapsules, PDMS and PCTIM (34Ne-9CF)

图7 含不同质量分数CF和纳米胶囊的PDMS基PCTIM样品的熔化温度(a)、熔化焓(b)、热导率(c)以及硬度(d)

Fig.7 Melting point (a), melting enthalpy (b), thermal conductivity (c) and hardness (d) of the PDMS based PCTIM samples containing different mass fractions of CF and the PA@SiO2 nanocapsules

图8 使用含不同质量分数CF和纳米胶囊的PDMS基PCTIM样品时模拟芯片的温升曲线[(a)、(c)]和平衡温度[(b)、(d)]

Fig.8 Temperature rise curves[(a),(c)] and equilibrium temperature [(b),(d)] of the simulative chip when employing the PDMS based PCTIM samples containing different mass fractions of CF and the PA@SiO2 nanocapsules

图9 34Ne-9CF经历100次冷热循环前后的DSC曲线

Fig.9 DSC curves of 34Ne-9CF before and after experiencing 100 heating-cooling cycles

表3 34Ne-9CF经历100次冷热循环前后的相变特性

Table 3 Phase change characteristics of 34Ne-9CF before and after experiencing 100 heating-cooling cycles

样品	T_m/℃	T_f/℃	H_m/(J/g)	H_f/(J/g)
34Ne-9CF	72.75	74.17	45.6	44.1
34Ne-9CF（100th）	72.62	73.77	44.6	43.2

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含石蜡@二氧化硅纳米胶囊和碳纤维的相变热界面材料及其散热性能

Combining paraffin@silica nanocapsules with carbon fiber to develop a phase change thermal interface material for efficient heat dissipation

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