Prediction study on bond strength and modulus of fused deposition modeling product

doi:10.11949/0438-1157.20190155

Abstract

Abstract:

A diffusion repatr model for the predicting bond strength between layers of fused deposition modeling (FDM) is introduced. The temperature-dependent diffusion model was determined based on the rheological data. The diffusion between the layers of the FDM components was predicted based on one-dimensional transient thermal analysis. The diffusion coefficient of temperature history was integrated with time to obtain the total diffusion of interfacial molecules, and then the interlaminar bond strength prediction model was obtained. The results showed that the predicted bond strength is in good agreement with the measured data under different printing conditions, which indicates that the prediction model is reasonable. Finally, the usability of the model is verified by a combination of three-point bending experiments and numerical simulations. Therefore, it can be used as an effective model for predicting the performance of FDM prints.

Key words: polymers, fused deposition modeling, prediction of interlaminar mechanical properties, diffusion, simulation

摘要：

主要介绍了一种用于预测熔融沉积模型(FDM)层间粘接强度的扩散修复模型。根据流变数据确定温度相关扩散模型，基于一维瞬态热分析预测FDM部件层间的扩散。将温度历史上的扩散系数对时间积分得到界面分子总扩散，进而得到层间粘接强度预测模型。结果表明：不同打印条件下预测结果与测得的粘合强度结果的吻合度较好，且该模型经修正后也适用于FDM部件弹性模量的预测。通过三点弯曲实验与数值模拟的结果对比，验证了粘接强度及模量预测模型的可用性。因此，可以作为FDM打印件承载性能预测的有效模型。

关键词: 聚合物, 熔融沉积成型, 层间粘接性能预测, 扩散, 数值模拟

CLC Number:

TQ 320.66

Li ZHANG, Xinyu WANG, Zheng LI, Junfeng GU, Shilun RUAN, Changyu SHEN. Prediction study on bond strength and modulus of fused deposition modeling product[J]. CIESC Journal, 2019, 70(7): 2727-2736.

张黎, 王新宇, 李征, 谷俊峰, 阮诗伦, 申长雨. 熔融沉积3D打印材料粘接强度及模量预测研究[J]. 化工学报, 2019, 70(7): 2727-2736.

Figures/Tables 21

Fig.1 Material bonding process

Fig.2 Fused deposition molding process and establishment of finite element model

Table 1 Parameters of different printing conditions

打印条件编号	打印速率/(mm/s)	喷嘴温度/℃	平台温度/℃	层高/mm	纤维宽度/mm	单层打印时间/s
1	40	250	100	0.2	0.4	6
2	60	250	100	0.2	0.4	4
3	20	250	100	0.2	0.4	12
4	40	230	100	0.2	0.4	6
5	40	250	80	0.2	0.4	6
6	40	250	100	0.1	0.4	6
7	40	250	100	0.3	0.4	6

Table 2 Material property parameters

比热容/

(J/(kg?℃))

热导率/

(W/(m?K))

密度/(kg/m³)

对流传热系数/

(W/(m²?℃))

2340

0.234

1040

Fig.3 Tensile strength results of samples under different printing conditions

Fig.4 Polarized image of cross section of sample and width measurement results

Table 3 Fiber widths and bond widths under different printing conditions

打印条件编号	纤维宽度/mm	粘接宽度/mm	纤维宽度/mm	f_wetting
1	0.40	0.33	0.43	0.78
2	0.40	0.34	0.44	0.77
3	0.40	0.34	0.44	0.78
4	0.40	0.33	0.44	0.76
5	0.40	0.32	0.43	0.75
6	0.40	0.39	0.43	0.90
7	0.40	0.27	0.44	0.61

Table 4 Environment and substrate temperature

打印条件编号	环境温度/℃	基底温度/℃
1	50.07	77.67
2	51.74	92.65
3	49.84	58.1
4	51.77	75.01
5	45.18	73.42
6	52.3	69.53
7	51.74	79.7

Fig.5 Interface temperature versus time curve under reference conditions

Fig.6 Viscosity versus temperature curve at frequency of 0.05 rad/s

Fig.7 Curves of diffusion parameters versus time under different printing conditions

Fig.8 Fit of model parameters and comparison of strength results

Fig.9 Stress-strain curve

Fig.10 Fit of model parameters and comparison of modulus results

Fig.11 Print sample

Fig.12 Finite element model and mesh

Table 5 Material properties for mechanical XFEM analysis

部件	弹性模量E/MPa	Poisson比ν	密度ρ/(kg/m³)
part-1	2300.00	0.38	1150
part-2	819.83	0.38	1150
压头/支座	2.10×10⁵	0.3	7900

Fig.13 Load-deflection curve

Fig.14 Local morphology of sample before and after fracture

Fig.15 Crack propagation process

Fig.16 Process of crack change with head displacement

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