高热通量芯片干冰冷却降温性能的理论分析

doi:10.11949/0438-1157.20201026

摘要/Abstract

摘要：

针对高热通量芯片的冷却散热问题，利用具有巨大升华潜热以及极低初始温度的干冰作为散热流体，通过建立干冰冷却的散热器模型，对散热器散热空间内干冰冷却降温过程的热流场进行模拟仿真，对干冰冷却的芯片降温特性进行分析，得出：干冰入口半径为6 mm，散热器针柱直径为2 mm、11×11均匀分布的散热效果最好。随着干冰流速逐渐增大，芯片温度达到稳定时间越快，流速为0.20 m/s时稳定温度为15.49℃，远低于芯片结温，0.06 m/s的流速即可达到芯片安全温度。干冰流速为0.20 m/s，在10 s时散热空间内已充满干冰，降温效果更好。功率为125 W时，干冰冷却也可将芯片中心测点（A点）温度稳定控制在49.47℃之下。此外，对比分析了P₀=65 W下的水冷式冷却降温与P₀=95 W下的干冰冷却降温性能，得出水冷式冷却稳定后的温度停留在74.2℃，干冰冷却稳定后的温度为15.49℃，干冰冷却降温的芯片整体温度分布更均匀，冷却效果更好。研究结果为进一步深入研究高热通量芯片干冰冷却降温系统打下基础。

关键词: 高热通量, 芯片, 干冰, 冷却降温, 性能分析

Abstract:

This paper aims at the heat dissipation and cooling of high heat flux chips, dry ice with huge sublimation latent heat and extremely low initial temperature is used as heat dissipation fluid. By establishing the model of dry ice cooling radiator, the heat flow fields of dry ice cooling process in the cooling space of radiator are simulated, and the characteristics of the dry ice cooling chip are analyzed. The results show that the best heat dissipation effect is that the radius of dry ice inlet is 6 mm, and the pin diameter of radiator is 2 mm and 11×11 is evenly distributed. With the increase of dry ice flow rate, it takes less time for the chip temperature to reach stability. When the flow rate is 0.20 m/s, the temperature of stability is 15.49℃, which is far lower than the junction temperature of the chip. The safe temperature of the chip can be obtained when the flow rate is 0.06 m/s. When the flow rate of dry ice is 0.20 m/s, the cooling space is filled with dry ice in only 10 s, so that better cooling effect can be obtained. When the power is 125 W, dry ice cooling can also stably control the temperature of the central measuring point (point A) of the chip below 49.47℃. Moreover, the cooling performance of water-cooled at P₀=65 W and dry ice-cooled at P₀=95 W are compared and analyzed. It is concluded that the stabilized temperature of water-cooled cooling chip is 74.2℃, and that of dry ice cooling chip is 15.49℃. The overall temperature distribution of the chip cooled by dry ice is more uniform and the cooling effect is better. The research results lay the foundation for further research on the dry ice cooling system of high heat flux chips.

Key words: high heat flux, chip, dry ice, cooling down, performance analysis

中图分类号:

TK 172

宁静红, 孙朝阳, 鲍春秀, 赵延峰. 高热通量芯片干冰冷却降温性能的理论分析[J]. 化工学报, 2021, 72(4): 2047-2056.

NING Jinghong, SUN Zhaoyang, BAO Chunxiu, ZHAO Yanfeng. Theoretical analysis on the cooling performance of high heat flux chip with dry ice[J]. CIESC Journal, 2021, 72(4): 2047-2056.

图/表 16

图1 CPU针柱式散热器模型

Fig.1 CPU pin column radiator model

图2 模型网格生成情况（隐藏部分边界）

Fig.2 Model mesh generation (hidden partial boundary)

表1 模型所选材料的参数及特性

Table 1 Parameters and properties of the material selected by the model

属性	干冰	气态二氧化碳	铜	硅	导热硅脂
恒压热容	770 J/(kg·K)	c_p(T)	385 J/(kg·K)	703 J/(kg·K)	1200 J/(kg·K)
密度	110 kg/m3	ρ(p,T)	8960 kg/m3	2203 kg/m3	2600 kg/m3
热导率	5 W/(m·K)	k(T)	400 W/(m·K)	1.38 W/(m·K)	12 W/(m·K)
动力黏度	5×10^-6 Pa·s	η(T)	—	—	—
比热率	1.3745	1.3	—	—	—

表2 模型相变相关参数

Table 2 Related parameters of model phase change

参数名称	值	描述
T_pc	-78.5℃	相变起始温度
T_deat	10℃	相变温度间隔
L₁₂	573.6 kJ/kg	相变潜热
T_us	-78.5℃	干冰进入初始温度
T₀	20℃	模型初始温度

图3 入口半径为5 mm与6 mm的芯片底部温度分布

Fig.3 Temperature distribution at the bottom of the chip with inlet radius of 5 mm and 6 mm

图4 针柱直径为1 mm与2 mm的芯片底部温度分布

Fig.4 Temperature distribution at the bottom of the chip with pin diameter of 1 mm and 2 mm

图5 针柱数量为11×11与15×15的速度场分布

Fig.5 Velocity field distributions with pin numbers 11×11 and 15×15

表3 不同针柱数量及间距下的芯片底面中心测点温度

Table 3 The temperature at the center of the bottom surface of the chip under different pin numbers and pin spacing distances

针柱直径/mm	针柱数量	间隔距离/ (mm×mm)	测点温度/℃
2	10×10	5.0×5.0	27.8517
2	11×11	4.5×4.5	26.4396
2	12×12	4.0×4.0	27.4226
2	13×13	3.8×3.8	31.2222
2 2	14×14 15×15	3.5×3.5 3.25×3.25	30.8857 30.3023

图6 模型温度场与压力场(t=600 s)

Fig.6 Temperature field and pressure field

图7 芯片底面位置(a)与底面测点分布（b）

Fig.7 Chip bottom position (a) and bottom measurement points distribution(b)

图8 不同流速下芯片底面测点A温度随时间变化曲线

Fig.8 The temperature change of the bottom surface of the chip A with time under different flow rates

图9 芯片底面各测点温度随时间变化曲线

Fig.9 The temperature change curve of each measuring point on the bottom surface of the chip with time

图10 模型内干冰体积分数变化

Fig.10 Change of dry ice volume fraction in the model

图11 不同功率下芯片温度随时间变化曲线

Fig.11 Variation of chip temperature with time under different power

图12 水冷模型与干冰模型散热效果对比

Fig.12 Comparison of heat dissipation effect between water cooling model and dry ice model

图13 水冷模型与干冰模型芯片底面温度分布

Fig.13 Temperature distribution on the bottom surface of the chip of water cooling model and dry ice model

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