楔形歧管微通道内的过冷流动沸腾模拟研究

doi:10.11949/0438-1157.20250557

摘要/Abstract

摘要：

面向高热通量电子器件热管理需求的高效冷却策略，以HFE7100和硅作为工作流体和固体材料，对Z形和楔形歧管微通道（MMC）内过冷流动沸腾过程进行模拟研究，讨论了具有不同楔角配置的楔形MMC对流量分布均匀性、总压降及压降分布均匀性、芯片温度及相体积分数的影响规律。结果表明，楔形MMC能够显著改善流量分布均匀性，其中Taper-200-50将流量分布的标准差最大降低了约50.9%。此外，楔形MMC可显著降低总压降及其波动幅度，有效改善压降分布的均匀性，从而提高流动稳定性。其中Taper-200-50将总压降降低57.3%~60.0%，压降波动标准差降低75.3%~85.1%，压降分布均匀性标准差降低81.2%~84.3%。在换热性能方面，楔形MMC的芯片平均温度与传统Z形差异较小，Taper-150-75和Taper-200-50表现出较优的换热性能，而Taper-250-25的换热效果最差，这表明当楔角过大时可能削弱换热效果。在所考虑的工况范围内，Taper-200-50的性能系数（COP）高达27713，性能评估准则（PEC）高达1.4，展现出优异的热管理潜力。

关键词: 微通道, 两相流, 数值模拟, 压降, 分布均匀性

Abstract:

To address the thermal management needs of high-heat-flux electronic devices, this study simulates subcooled flow boiling in Z-shaped and wedge-shaped manifold microchannels (MMCs) using HFE7100 and silicon as the working fluid and solid material. The effects of wedge-shaped MMCs with different wedge angle configurations on flow distribution uniformity, total pressure drop and pressure drop distribution uniformity, chip temperature, and phase volume fraction are discussed. The results show that wedge-shaped MMC can significantly improve flow distribution uniformity. Specifically, the Taper-200-50 reduces the standard deviation of flow distribution by up to approximately 50.9%. In addition, wedge-shaped MMCs can substantially reduce total pressure drop and its fluctuations, effectively improving the uniformity of pressure drop distribution and thereby improving flow stability during the flow boiling process. Specifically, the Taper-200-50 configuration reduces the total pressure drop by 57.3% to 60.0%, the standard deviation of pressure drop fluctuations by 75.3% to 85.1%, and the standard deviation of pressure drop distribution by 81.2% to 84.3%. In terms of heat transfer performance, the average chip temperature in wedge-shaped MMCs is similar to that of the conventional Z-shaped structure. Taper-150-75 and Taper-200-50 exhibit better heat transfer performance, while Taper-250-25 shows the poorest performance, indicating that an excessively large wedge angle may hinder heat transfer. Under the considered operating conditions, the Taper-200-50 achieves a coefficient of performance (COP) of up to 27713 and a performance evaluation criterion (PEC) of up to 1.4, demonstrating excellent potential for thermal management applications.

Key words: microchannel, two-phase flow, numerical simulation, pressure drop, distribution uniformity

中图分类号:

TK 123

马紫欢, 杨小平, 郝南京, 魏进家. 楔形歧管微通道内的过冷流动沸腾模拟研究[J]. 化工学报, 2025, 76(12): 6289-6301.

Zihuan MA, Xiaoping YANG, Nanjing HAO, Jinjia WEI. Simulation study of subcooled flow boiling in wedge-shaped manifold microchannels[J]. CIESC Journal, 2025, 76(12): 6289-6301.

图/表 15

图1 (a)MMC散热器示意图；(b)带有边界条件的Z形MMC计算区域；(c)Z形MMC的俯视图；(d)Taper-200-50的俯视图

Fig.1 (a) Schematic diagram of MMC heat sink; (b) Calculation region of Z-shaped MMC with boundary conditions; (c) Top view of Z-shaped MMC; (d) Top view of Taper-200-50

表1 MMC散热器的几何参数和尺寸

Table 1 Geometrical parameters and dimensions of the MMC heat sink

MMC配置	参数	值/μm	MMC配置	参数	值/μm
Z形MMC	L_in1, L_out2	100	Taper-200-50	L_in1, L_out2	200
	L_in2, L_out1	100		L_in2, L_out1	50
	L_m	100		L_m	50
Taper-150-75	L_in1, L_out2	150	Taper-250-25	L_in1, L_out2	250
	L_in2, L_out1	75		L_in2, L_out1	25
	L_m	75		L_m	25

表2 HFE7100和硅的热物性参数

Table 2 Thermophysical properties of HFE7100 and silicon

参数	液相HFE7100	气相HFE7100	Si
密度ρ/(kg/m³)	1402	11.5	2300
比热容c_p /(J/(kg·K))	1263	870	700
热导率k/(W/(m·K))	0.058	0.01	150
黏度μ/(Pa·s)	0.0004	1.32×10^-5	—
汽化热h_l_v/(kJ/kg)	111.6	—	—
表面张力σ/(N/m)	0.00943	—	—
饱和温度T_sat/K	339	—	—

图2 (a)网格无关性分析和(b)数值模型验证

Fig.2 (a) Mesh independent analysis and (b) validation of the numerical model

图3 (a)恒定热通量下各MMC微通道的质量流速分布；(b)各工况下微通道质量流速分布的标准差；(c)不同热通量下Taper-200-50每个微通道的质量流速分布

Fig.3 (a) Mass flux distribution in microchannel of the four MMCs under constant heat flux; (b) Standard deviation of mass flux distribution in microchannel at 12 operating conditions; (c) Mass flux distribution in microchannel of Taper-200-50 under different heat fluxes

图4 各工况下(a)准稳态时间范围内的总压降和(b)压降波动的标准差

Fig.4 (a) Total pressure drop within the quasi-steady-state period and (b) standard deviation of pressure drop fluctuations under various operating conditions

图5 各工况下总压降随时间的变化曲线

Fig.5 Variation of total pressure drop with time under various operating conditions

图6 (a)恒定热通量下各MMC每个微通道的压降分布和(b)各工况下微通道的压降分布标准差

Fig.6 (a) Pressure drop distribution in microchannel under constant heat flux for different MMC configurations, and (b) standard deviation of pressure drop distribution in microchannel under various operating conditions

图7 各工况下准稳态时间范围内各微通道的进口和出口压力值

Fig.7 Inlet and outlet pressure values in each microchannel within the quasi-steady-state period for various operating conditions

图8 (a)~(c)芯片平均温度随时间的变化趋势和(d)准稳态时间范围内芯片温度的平均值

Fig.8 (a)—(c) The trend of the average chip temperature over time and (d) the average value of chip temperature over the quasi-steady-state period

图9 6种工况下固体域的温度云图和流体域的气相体积分数等值线

Fig.9 Temperature contours in the solid domain and contours of vapor volume fraction in the fluid domain for 6 operating conditions

图10 热通量为200 W/cm2时的芯片平均温度云图

Fig.10 Chip surface temperature contours at a heat flux of 200 W/cm2

图11 不同热通量下Taper-200-50总气相体积分数随时间的变化趋势(a)和准稳态时间范围内的总气相体积分数平均值(b)

Fig.11 (a) The variation of the total vapor volume fraction in Taper-200-50 with time, and (b) the average value of total vapor volume fraction for quasi-steady-state period at different heat fluxes

图12 各工况下准稳态时间范围内每个微通道的气相体积分数平均值

Fig.12 Average vapor volume fraction in microchannels within the quasi-steady-state period under various operating conditions

图13 各工况下的COP和PEC对比

Fig.13 Comparison of COP and PEC under various operating conditions

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