Abstract:

As the development of integration and flexibility of electronic devices, the traditional tin-lead solders, indium tin oxide (ITO) films and other materials no longer meet the requirements of properties, such as electric conductivity, thermal conductivity and flexibility. Metallic nanowires have excellent photoelectric properties and unique one-dimensional structure. New materials with them as key components have become the most potential substitutes for traditional electronic materials. The commercialization of metallic nanowires involves the aspects of raw material, equipment, process and application. However, the key technique lies in the large-scale, low-cost, green and efficient preparation of metallic nanowires. In this paper, the preparation methods of metallic nanowires are reviewed, including physical vapor deposition, chemical vapor deposition, template assisted, solvothermal process and polyol method. The applications of metallic nanowires in the field of electronic materials, such as conductive adhesives, transparent conductive films and thermal interface materials are summarized.

Key words: metallic nanowires, transparent conductive films, conductive adhesives, thermal interface materials, electronic materials, preparation, nano materials

摘要：

随着电子器件向集成化、柔性化的发展，传统锡铅焊料、氧化铟锡薄膜等电子材料已经不能满足导电、导热、柔性等性能的要求。金属纳米线具备优异的光电性能和独特的一维结构，以其为关键成分的新材料成为传统电子材料最具潜力的替代品。金属纳米线产业链的发展涉及原料、设备、工艺与应用多方面，但关键技术在于金属纳米线的大规模、低成本、绿色高效制备。综述了近年来金属纳米线的主要制备方法，包括物理气相沉积法、化学气相沉积法、模板法、溶剂热法以及多元醇法，并对金属纳米线在导电胶、透明导电薄膜、热界面材料等电子材料的最新应用进展进行了概述。

关键词: 金属纳米线, 透明导电薄膜, 导电胶, 热界面材料, 电子材料, 制备, 纳米材料