Heat transfer performance of ultra-thin plate heat pipe with sintered porous channels structures wick

doi:10.11949/j.issn.0438-1157.20180720

Abstract

Abstract:

An ultra-thin plate heat pipe with a total thickness of 0.85 mm was designed and manufactured. The capillary core of the heat pipe adopts a sintered porous channel structure to realize the combination of the channel and the porous structure. According to this structure, an aluminum mold was manufactured. The heat pipe design combines the features of ultra-thin and easy fabrication, and sets up an experimental platform for heat pipe performance testing. The influence of heating power, copper powder particle size, and number of channels on thermal performance were analyzed. Thermal resistance and maximum heat transport capacity were used to characterize the performance of heat pipes. The results show that when the heating power is 14 W, the temperature of the heated copper block with copper plate and heat pipe is 102℃ and 66℃, respectively, and the heat pipe effectively reduces the temperature of the heat source. When the particle size of the copper powder is larger, the thermal resistance and the heat transfer limit of the heat pipe are also larger. When the particle size decreases, the opposite phenomenon occurs. Compared to the single-channel structure, the dual-channel structure has a lower thermal resistance, and the lowest difference is 21%.

Key words: ultra-thin flat heat pipe, sintering, porous channels structure, heat transfer, particle size of copper powder, thermal performance, experimental validation

摘要：

设计并制作了总厚度为0.85 mm的超薄平板热管，热管的毛细芯采用烧结多孔槽道结构，实现了槽道和多孔结构的结合，根据该结构制作了一个铝制模具。该热管设计结合了超薄化和易制作的特点，对热管性能测试搭建了实验平台，分析了加热功率、铜粉粒径、槽道数目对热管热性能的影响，热阻和最大传热能力用来表征热管的性能。结果表明在加热功率为14 W时，放置铜板和热管的加热铜块温度分别是102℃和66℃，热管有效降低了热源温度；当铜粉粒径较大时热管的热阻和传热极限也较大，粒径减少时出现相反现象。相比单槽道结构，双槽道结构出现了更低热阻，两者最小差异为21%。

关键词: 超薄平板热管, 烧结, 多孔槽道结构, 传热, 铜粉粒径, 热性能, 实验验证

CLC Number:

TK 124

Minghan ZHU, Pengfei BAI, Yanxin HU, Jin HUANG. Heat transfer performance of ultra-thin plate heat pipe with sintered porous channels structures wick[J]. CIESC Journal, 2019, 70(4): 1349-1357.

朱明汉, 白鹏飞, 胡艳鑫, 黄金. 烧结多孔槽道吸液芯超薄平板热管的传热性能[J]. 化工学报, 2019, 70(4): 1349-1357.

Figures/Tables 13

Fig.1 Flat heat pipe structure

Fig.2 Molds and samples

Fig.3 Schematic of experimental testing system

Fig.4 Distribution of thermocouples

Fig.5 Heat pipe temperature distributions under different heat load

Fig.6 Copper plate temperature distributions under different heat load

Fig.7 Dynamic temperature characteristics of heat pipe under incremental total heat inputs ranging from 1 W to 14 W

Fig.8 Thermal resistance of heap pipe and copper plate under different heat load

Table 1 Porosity of wick structure

Wick structure	Porosity/%
copper powder 120—180 μm	39.13
copper powder 75—120 μm	34.56
copper powder 58—75 μm	32.23

Fig.9 Copper particle size effect on performance (double channel)

Fig.10 Copper particle size effect on performance (single channel)

Fig.11 Effect of number of channels on thermal resistance

Fig.12 Schematic diagram of two channel structures

References 34

1	王辉, 汤勇, 余建军 . 相变传热微通道技术的研究进展[J]. 机械工程学报, 2010, 46(24): 101-106.
	Wang H , Tang Y , Yu J J . Recent advances of the phase change micro-channel cooling structure[J]. Journal of Mechanical Engineering, 2010, 46(24): 101-106.
2	Li J . Patents review for cooling of high power electronic components[J]. Recent Patents on Engineering, 2008, 2(2): 174-188.
3	Li J , Lv L C . Micro flat heat pipes for microelectronics cooling: review[J]. Recent Patents on Mechanical Engineering, 2013, 6(3): 120-127.
4	Marcinichen J B , Thome J R , Michel B . Cooling of microprocessors with micro-evaporation: a novel two-phase cooling cycle[J]. International Journal of Refrigeration, 2010, 33(7): 1264-1276.
5	郝俊娇, 潘日, 周刚, 等 . 高热通量电子元件中热管散热技术的进展[J]. 化工进展, 2015, 34(5): 1220-1224.
	Hao J J , Pan R , Zhou G , et al . Development of heat pipe cooling technology in high heat flux electronic components[J]. Chemical Industry and Engineering Progress, 2015, 34(5): 1220-1224.
6	Marcinichen J , Olivier J , Lamaison N , et al . Advances in electronics cooling[J]. Heat Transfer Engineering, 2013, 34(56): 434-446.
7	张程宾, 施明恒, 陈永平, 等 . “Ω”形轴向槽道热管的流动和传热特性[J]. 化工学报, 2008, 59(3): 544-550.
	Zhang C B , Shi M H , Chen Y P , et al . Flow and heat transfer characteristics of heat pipe with axial “Ω” -shaped grooves[J]. Journal of Chemical Industry and Engineering(China), 2008, 59(3): 544-550.
8	林振玄, 马琦, 汪国山, 等 . 一种铜丝结构的新型微槽道平板热管[J]. 化工学报, 2010, 61(1): 27-31.
	Lin Z X , Ma Q , Wang G S , et al . Thermal performance of a new copper wire-bonded f at heat pipe[J]. CIESC Journal, 2010, 61(1): 27-31.
9	Kempers R , Ewing D , Ching C Y . Effect of number of mesh layers and fluid loading on the performance of screen mesh wicked heat pipes[J]. Applied Thermal Engineering, 2006, 26(5/6): 589-595.
10	Lv L C , Li J . Managing high heat flux up to 500 W·cm^-2 through an ultra-thin flat heat pipe with superhydrophilic wick[J]. Applied Thermal Engineering, 2017, 122: 593-600.
11	纪献兵, 徐进良, Abanda A M , 等 . 超轻多孔泡沫金属平板热管的传热性能研究[J]. 中国电机工程学报, 2013, 33(2): 72-78.
	Ji X B , Xu J L , Abanda A M , et al . Investigation on heat transfer performance of flat heat pipes with ultra-light porous metal foam wicks[J]. Proceedings of the CSEE, 2013, 33(2): 72-78.
12	Tang Y , Yuan D , Lu L S , et al . A multi-artery vapor chamber and its performance[J]. Applied Thermal Engineering, 2013, 60(1/2): 15-23.
13	董梁, 徐伟强, 李倩倩 . 异形整体式热管散热器传热实验与分析[J]. 化工学报, 2016, 67(10): 4104-4110.
	Dong L , Xu W Q , Li Q Q . Experiment and simulation analysis of special-shaped overall heat pipe radiator[J]. CIESC Journal, 2016, 67(10): 4104-4110.
14	Li Y , He H F , Zeng Z X . Evaporation and condensation heat transfer in a heat pipe with a sintered-grooved composite wick[J]. Applied Thermal Engineering, 2013, 50(1): 342-351.
15	Singh R , Akbarzadeh A , Mochizuki M , et al . Flat miniature heat pipe with composite fibre wick structure for cooling of mobile handheld devices[C]//ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems Collocated with the ASME 2005 Heat Transfer Summer Conference. San Francisco, California, USA, 2005: 409-414.
16	Tang Y , Deng D X , Lu L S , et al . Experimental investigation on capillary force of composite wick structure by IR thermal imaging camera[J]. Experimental Thermal & Fluid Science, 2010, 34(2): 190-196.
17	Huang X , Franchi G . Design and fabrication of hybrid bi-modal wick structure for heat pipe application[J]. Journal of Porous Materials, 2008, 15(6): 635-642.
18	Zhou G H , Li J , Lv L C . An ultra-thin miniature loop heat pipe cooler for mobile electronics[J]. Applied Thermal Engineering, 2016, 109: 514-523.
19	刘昌泉, 尚炜, 赵举贵, 等 . 纳米修饰吸液芯超薄平板热管的传热特性[J]. 化工学报, 2017, 68(12): 4508-4516.
	Liu C Q , Shang W , Zhao J G , et al . Heat transfer characteristics of ultra-thin flat heat pipe with nano-modified porous wick[J]. CIESC Journal, 2017, 68(12): 4508-4516.
20	Lee D , Chan B . Fabrication and characterization of pure-metal-based submillimeter-thick flexible flat heat pipe with innovative wick structures[J]. International Journal of Heat & Mass Transfer, 2018, 122: 306-314.
21	Yang K S , Lin C C , Shyu J C , et al . Performance and two-phase flow pattern for micro flat heat pipes[J]. International Journal of Heat & Mass Transfer, 2014, 77: 1115-1123.
22	Mizuta K , Fukunaga R , Fukuda K , et al . Development and characterization of a flat laminate vapor chamber[J]. Applied Thermal Engineering, 2016, 104: 461-471.
23	Aoki H , Shioya N , Ikeda M , et al . Development of ultra thin plate-type heat pipe with less than 1 mm thickness[C]//26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Japan : IEEE, 2010: 207-212.
24	Yang K S , Tu C W , Zhang W H , et al . A novel oxidized composite braided wires wick structure applicable for ultra-thin flattened heat pipes[J]. International Communications in Heat & Mass Transfer, 2017, 88: 84-90.
25	Li Y , Zhou W J , He J B , et al . Thermal performance of ultra-thin flattened heat pipes with composite wick structure[J]. Applied Thermal Engineering, 2016, 102: 487-499.
26	Lee K C , Chung S L . Ultra-thin heat pipe and manufacturing method thereof: US20100319882[P]. 2010-12-23.
27	Zhou W J , Xie P D , Li Y , et al . Thermal performance of ultra-thin flattened heat pipes[J]. Applied Thermal Engineering, 2017, 117: 773-781.
28	Ding C S , Soni G , Bozorgi P , et al . A flat heat pipe architecture based on nanostructured titania[J]. Journal of Microelectromechanical Systems, 2010, 19(4): 878-884.
29	Lewis R , Liew L A , Xu S S , et al . Microfabricated ultra-thin all-polymer thermal ground planes[J]. Science Bulletin, 2015, 60(7): 701-706.
30	Ivanova M , Lai A , Gillot C , et al . Design, fabrication and test of silicon heat pipes with radial microcapillary grooves[C]//Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems. San Diego, USA: IEEE, 2009: 545-551.
31	Oshman C , Li Q , Liew L A , et al . Flat flexible polymer heat pipes[J]. Journal of Micromechanics & Microengineering, 2012, 23(1): 15001-15006.
32	Kline S J , McClintock F A . Describing uncertainties in single-sample experiments[J]. Mechanical Engineering, 1953, 75(1): 3-8.
33	Li Y , Li Z X , Zhou W J , et al . Experimental investigation of vapor chambers with different wick structures at various parameters[J]. Experimental Thermal & Fluid Science, 2016, 77: 132-143.
34	Ji X B , Li H C , Xu J L , et al . Integrated flat heat pipe with a porous network wick for high-heat-flux electronic devices[J]. Experimental Thermal & Fluid Science, 2017, 85: 119-131.

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