Abstract:

A new structured heat pipe radiator was designed with integration of the evaporator of flat heat pipes and the condenser of finned cupper cylinders, in order to meet the new requirements of heat dissipation and uniform temperature of electrical and electronic equipment. Heat transfer experiments and simulation analysis were performed to study temperature distribution across the heat pipe under various conditions, factors influencing performance and heat transfer capacity. Results showed good temperature control across the heat pipe with difference in the range of 1.75℃. Heating power and convection heat dissipation had influence on starting performance, overall thermal resistance, equivalent thermal conductivity and heat transfer coefficient. With the increase of heating power and convection rate, both start-up time and thermal resistance were decreased whereas equivalent coefficient of thermal conductivity and coefficient of heat transfer were increased. The minimum thermal resistance and the optimal equivalent thermal conductivity of the heat pipe were 0.189℃·W^-1 and 20964 W·m^-1·K^-1, respectively. Compared to traditional heat pipe of same dimensions, the new design had a reduction in thermal resistance by 37% and an increase in heat transfer coefficient by 15%.

Key words: heat pipe, heat transfer, heat resistance, equivalent thermal conductivity

摘要：

针对电子电气设备散热和均温的需求，提出了一种新型结构形式的异形整体热管散热器：平板热管形式的蒸发段与具有高肋化比翅片的冷凝铜管集成。对该热管进行了传热实验与分析，研究热管在不同工况下温度数值及分布，探究影响热管性能的因素和规律，验证其传热能力。结果表明：在各种工况下热管温差始终在1.75℃之内，均温性能良好。加热功率和对流散热状况对热管启动性能、总体热阻、当量热导率、传热系数都有影响。随着加热功率和对流速度增加，热管启动时间和热阻均降低，当量热导率和传热系数则逐渐上升。热阻最低为0.189℃·W^-1，最佳当量热导率为20964 W·m^-1·K^-1。相比于同等尺寸的传统热管，热阻降低了37%，传热效率提升15%。

关键词: 热管, 传热, 热阻, 当量热导率