化工学报 ›› 2005, Vol. 56 ›› Issue (2): 301-305.

• 表面与界面工程 • 上一篇    下一篇

镁合金化学镀镍层的生长过程

邵忠财;李建中;康凤娣;田彦文   

  1. 沈阳理工大学环境与化学工程学院,辽宁 沈阳 110168;东北大学材料与冶金学院,辽宁 沈阳 110004
  • 出版日期:2005-02-25 发布日期:2005-02-25

Deposition process of electroless nickel plating on magnesium alloy

SHAO Zhongcai;LI Jianzhong;KANG Fengdi;TIAN Yanwen   

  • Online:2005-02-25 Published:2005-02-25

关键词: 镁合金, 化学镀, 生长过程, 腐蚀

Abstract: The initial nickel deposition for the direct electroless nickel plating on non-catalytically active magnesium alloy is critical.The surface morphology and composition of the initial nickel plating coating are obtained by means of the scanning electron microscopy (SEM) and the energy dispersive X-ray (EDS).In addition, the mass gain/loss in the initial nickel deposition process was measured by using the electro-balance.The results showed that the MgO coating was gradually corroded by the plating solution, at the same time, MgF2 produced by F-,H+ and MgO was deposited on the substrate during the initial electroless plating process.The nickel of the initial electroless plating was mostly growing on the boundary between the MgF2 coating and the MgO coating of the activation substrate, and then came to two sides.After that, the Ni-P coating growth rate to cover with the MgF2 coating was prior to the MgO coating.The electroless plating was in company with the substrate corrosion,but the electroless plating rate catalyzed by the exchanged nickel was more than the substrate corrosion rate.

Key words: 镁合金, 化学镀, 生长过程, 腐蚀