[1] Yun C S. Static and dynamic thermal characteristic of IGBT power modules// Power Semiconductor Device and ICs[C]. Toronto, Canada,1999
[2] Chen Dengke (陈登科). New technologies of electronics cooling [J]. Chinese Journal of Low Temperature Physics (低温物理学报), 2005, 27(3): 255-262
[3] Zhang Yaping (张亚平), Feng Quanke (冯全科), Yu Xiaoling (余小玲). Applications of micro heat pipes in electronics cooling[J]. International Electronic Element (国外电子元器件), 2006(9): 11-15
[4] Cotter T P. Principles and prospects for micro heat pipe// Proceedings of 5th International Heat Pipe Conference[C]. Tsukuba, 1984: 328-335
[5] Balram Suman, Sirshendu De, Sunando DasGupta. A model of the capillary limit of a micro heat pipe and prediction of the dry-out length[J]. International Journal of Heat and Fluid, 2005, 26(3): 495-505
[6] Le Berre M, Launay S, Sartre V, Lallemand M. Fabrication and experimental investigation of silicon micro heat pipes for cooling electronics[J]. Journal of Micromechanics and Microengineering, 2003, 13(3): 436-441
[7] Ponnappan R. A novel micro-capillary groove-wick miniature heat pipe//Energy Conversion Engineering Conference and Exhibit[C]. Las Vegas, 2000
[8] Zheng Li (郑丽), Wang Aiming (王爱明), Li Juxiang (李菊香). Research progress of wick in heat pipe[J]. Cryogenics and Superconductivity (低温与超导), 2011, 39(4): 43-47
[9] Cao Y, Gao M, Beam J E, Donovan B. Experimental and analysis of flat miniature heat pipes[J]. Journal of Thermophysics and Heat Transfer, 1997, 11(2): 158-164
[10] Tang Y, Chi Y, Chen J Ch, Deng X X, Liu L, Liu X K. Experimental study of oil-filled high-speed spin forming micro-groove fin-inside tubes[J]. International Journal of Machine Tools & Manufacture, 2007, 47(7): 1059-1068
[11] Wang Xiaowu, Tang Yong,Chen Ping. Investigation into performance of heat pipe with micro grooves fabricated by extrusion-ploughing process[J]. Energy Conversion and Management, 2009, 50(5): 1384- 1388
[12] Wang Y, Peterson G P. Investigation of a novel flat heat pipe[J]. Journal of Heat Transfer, 2005, 127(2): 165-170
[13] Jiang Chaoyong (蒋朝勇), Xiahou Guowei (夏侯国伟). The thermal performance of a new-style miniature flat heat pipes[J]. Journal of Changsha University of Science and Technology:Natural Science (长沙理工大学学报:自然科学版), 2009, 6(1): 65-68
[14] Kou Zhihai (寇志海), Bai Minli (白敏丽), Yang Hongwu (杨洪武), Niu Ling (牛玲), Xu Rangshu (徐让书). Numerical and experimental investigation on flat heat pipes with integral micro-grooved wicks[J]. Proceedings of the CSEE (中国电机工程学报), 2012, 32(35): 92-100
[15] Fan Chunli (范春利), Qu Wei (曲伟), Sun Fengrui (孙丰瑞), Yang Li (杨立), Ma Tongze (马同泽). Status and recent progress of research on micro/miniature heat pipe[J]. Chinese Journal of Electron Devices (电子器件), 2004, 27(1): 211-216
[16] Zheng Li (郑丽), Li Juxiang (李菊香), Zhu Min (朱珉).Heat transfer of porous metal foam wick heat pipe[J]. CIESC Journal (化工学报), 2012, 63(12): 3861-3866
[17] Chen Lanlan (陈兰兰), Xiahou Guowei (夏侯国伟), Jiang Chaoyong (蒋朝勇), Yang Caiyun (杨彩云). The thermal performance of a flat pulsating heat pipe with double sides rectangular channel[J]. Journal of Changsha University of Science and Technology:Natural Science (长沙理工大学学报:自然科学版), 2011, 8(1): 61-64 |