Abstract: A novel liquid thermoelectric cooling device is developed and assembled for sub-ambient temperature cooling of chips in over-clocking or super calculating. A testing system was set up and experiments were conducted to investigate the thermal performance of the novel cooling device under various application conditions. Results showed that the maximum heat dissipating capacity was 45.2 W·cm^-2 and the lowest total thermal resistance was 0.107℃·W^-1 at case temperature of 65℃ and cooling air flowrate of 7-13 m·s^-1. The case temperature of the heat source was reduced 4.0 and 4.6℃, respectively, at cooling air flowrate of 9 and 13 m·s^-1, with input heat flux of 28.5 W·cm^-2 and TEC at its optimum input voltage. The cooling performance of the device is also closely related with the input voltage of TEC. With the heat flux of heat source at 28.5 W·cm^-2 and cooling air flowrate of 9 and 13 m·s^-1, the optimum operating voltage of TEC is 28 and 32 V, respectively.

Key words: thermoelectric cooling, microelectronic chips, heat sink, heat transfer, microchannels, design

摘要： 旨在开发一种新型热电制冷液体冷却装置，解决微电子设备芯片超频运行后的冷却问题。通过搭建实验测试平台，对该新型冷却装置在不同热通量、不同工况以及热电制冷器（TEC）在不同工作电压下的传热性能进行了实验研究。研究表明，限定热源表面温度（65℃）时，该散热器在实验风速7～13 m·s^-1的条件下，最大散热能力可达45.2 W·cm^-2，装置最低总热阻为0.107℃·W^-1；当热通量为28.5 W·cm^-2、风速为9 m·s^-1和13 m·s^-1时，TEC工作在最佳电压值下，使热源表面温度分别降低4.0℃和4.6℃。实验结果同时表明，新型热电制冷液体冷却装置的制冷性能与TEC工作电压相关，当热通量为28.5 W·cm^-2、风速为9 m·s^-1和13 m·s^-1时，最佳工作电压分别为28 V和32 V。

关键词: 热电制冷, 微电子芯片, 散热器, 传热, 微通道, 设计