化工学报 ›› 2013, Vol. 64 ›› Issue (11): 4269-4273.DOI: 10.3969/j.issn.0438-1157.2013.11.052

• 材料化学工程与纳米技术 • 上一篇    

氯甲基笼型倍半硅氧烷改性双酚A环氧树脂性能

谭军1, 王华金2, 沙宝祥1,3, 韦晓燕1, 俞强3   

  1. 1. 嘉兴学院生物与化学工程学院, 浙江 嘉兴 314001;
    2. 嘉兴学院材料与纺织工程学院, 浙江 嘉兴 314001;
    3. 常州大学材料科学与工程学院, 江苏 常州 213164
  • 收稿日期:2013-05-06 修回日期:2013-07-21 出版日期:2013-11-05 发布日期:2013-11-05
  • 通讯作者: 谭军
  • 作者简介:谭军(1979-),男,博士,副教授。
  • 基金资助:

    嘉兴市科技计划项目(2009AY2003,2012AY1025);国家自然科学基金项目(20906038)。

Properties of biphenyl A epoxy resin modified by choromethyl polyhedral silsesquioxane

TAN Jun1, WANG Huajin2, SHA Baoxiang1,3, WEI Xiaoyan1, YU Qiang3   

  1. 1. School of Biological and Chemical Engineering, Jiaxing University, Jiaxing 314001, Zhejiang, China;
    2. School of Materials and Textile Engineering, Jiaxing University, Jiaxing 314001, Zhejiang, China;
    3. School of Materials Science and Engineering, Changzhou University, Changzhou 213164, Jiangsu, China
  • Received:2013-05-06 Revised:2013-07-21 Online:2013-11-05 Published:2013-11-05
  • Supported by:

    supported by the Science and Technology Project Foundation of Jiaxing City(2009AY2003,2012AY1025)and the National Natural Science Foundation of China(20906038).

关键词: 氯甲基倍半硅氧烷, 环氧树脂, 固化反应, 热性能, 力学性能

Abstract: Hybrid epoxy resin composite materials were prepared from choromethyl polyhedral silsesquioxane(CM-POSS),bisphenol epoxy(E-51),MeTHPA and TEA.The curing reaction of hybrid epoxy,and mechanical and thermal properties of the cured epoxy were characterized by Fourier transform infrared spectroscopy(FT-IR),differential scanning calorimetry(DSC),thermogravimetric analysis(TGA)and heat distortion temperature tester.CM-POSS was connected in cross-linked epoxy resin system by chemical reaction in the curing reaction process.Thermal properties,tensile,bending and impact strengthes of the cured hybrid resin were improved with increased content of CM-POSS.Addition of CM-POSS could make the Tg and rigidity of epoxy resin increase but had little effect on tenacity.

Key words: chloromethyl polyhedral silsesquioxane, epoxy resin, curing reaction, thermal properties, mechanical properties

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