航天器舱内环境下非金属增材制造热效应分析

doi:10.11949/0438-1157.20191118

摘要/Abstract

摘要：

针对未来空间站后续运营与维护发展中对无人自主非金属增材制造技术的应用需求，对空间舱内环境下增材制造过程中的热环境进行了分析，对增材制造装置建模，多热源空间分布与产热特性分析，局部保温及整体强化对流设计热扩散效应与温度场仿真，并对增材制造装置的热控措施开展了试验验证。分析表明：密闭装置功耗72～96 W，在初始温度为20℃条件下装置壁面温度维持在29℃左右，与环境之间的散热效率可达21.6 W·m^-2，满足空间增材制造的温度要求，满足装置的温度稳定性与可靠性，为我国空间在轨试验验证给予了一定的理论指导，也为未来舱外环境下的热控设计提供新的思路与方案。

关键词: 非金属增材制造, 热力学, 航天器, 环境, 试验验证

Abstract:

In view of application requirement of unattended non-metallic augmentation manufacturing technology in the future operation and maintenance development of space station, the thermal environment in the process of augmentation manufacturing in the space cabin environment is analyzed. The device was modeled, the distribution and heat production characteristics of the multiple heat sources was analyzed, the thermal diffusion effect was controlled, and temperature field simulation of local thermal insulation and integral enhanced convection design were carried out. Results showed that, the power consumption of the airtight device is about 72－96 W, the wall temperature of the device is maintained at about 29℃ when the initial temperature is 20℃, and the heat dissipation efficiency between the device and the environment can reach 21.6 W·m^-2, which meets the temperature requirement of space material addition manufacturing and the temperature stability and reliability of the device. It provides certain theoretical guidance for on-orbit test verification in China, and provides new ideas and schemes for future extravehicular environment.

Key words: nonmetallic addition manufacture, thermodynamics, spacecraft, environment, experimental validation

中图分类号:

V 444.3⁺6

杨东升, 阿嵘, 张建斌, 王大鹏, 张斌, 徐迎丽, 秦俊杰, 刘淑芬. 航天器舱内环境下非金属增材制造热效应分析[J]. 化工学报, 2020, 71(S1): 486-493.

Dongsheng YANG, Rong A, Jianbin ZHANG, Dapeng WANG, Bin ZHANG, Yingli XU, Junjie QIN, Shufen LIU. Thermal effect analysis of nonmetallic addition manufacturing in spacecraft cabin environment[J]. CIESC Journal, 2020, 71(S1): 486-493.

图/表 9

图1 增材制造系统结构组成

Fig.1 Structure composition of additional material manufacturing system

表1 不同工况下各部件功耗测试结果

Table 1 Power consumption test result for each component under different working conditions

序号	工况	电源/W	打印头/W	电机/W	监测装置/W	控制器/W	总功耗/W
1	电源待机	10.2	—	—	—	—	10.2
2	打印预热	10.2+	36	—	—	—	54
3	正常打印1	10.2+	36	16	10	10	96
4	正常打印2	10.2+	—	16	10	10	72

图2 热源阶跃性变化

Fig.2 Schematic diagram of step change of heat source

图3 装置自然状态下的热分析

Fig.3 Thermal analysis of unit in nature state

图4 打印块的高效阻热设计

Fig.4 High efficient thermal resistance design of printing block

图5 热控后仿真与试验测试结果

Fig.5 Results of simulation and experiment after thermal control

图6 增材制造装置温度测试平台

Fig.6 Temperature testing platform for adding material manufacturing device

图7 不同工况下装置温度场仿真分析与主要部件实测变化曲线

Fig.7 Simulation analysis of temperature field and test curve of main components under different working conditions

表2 低温（-5℃）下的实测温度与仿真对比分析

Table 2 Comparison of test and simulated temperature at -5℃

序号	装置	实测温度/℃	仿真结果/℃	温度差/℃
1	电源	15.23	13.51	1.72
2	电路板1	17.12	14.05	3.07
3	电路板2	10.36	8.67	1.69
4	打印头支架	5.35	8.92	3.57
5	打印头上部	29.68	28.43	1.25
6	送丝电机	5.63	8.16	1.53
7	X电机	15.17	16.23	1.06
8	Y电机	10.64	11.81	1.17
9	Z电机	12.56	12.21	0.35

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