CIESC Journal ›› 2019, Vol. 70 ›› Issue (S2): 76-84.DOI: 10.11949/0438-1157.20190493

• Thermodynamics • Previous Articles     Next Articles

Measurement of in-plane thermal conductivity of glued graphite film based on thermal imaging

Dexin HOU(),Yue CHEN,Shuliang YE()   

  1. Institute of Industry and Trade Measurement Technique, China Jiliang University, Hangzhou 310018, Zhejiang, China
  • Received:2019-05-09 Revised:2019-07-11 Online:2019-09-06 Published:2019-09-06
  • Contact: Shuliang YE

基于热成像的背胶石墨膜面向热导率测试方法

侯德鑫(),陈玥,叶树亮()   

  1. 中国计量大学工业与商贸计量技术研究所,浙江 杭州 310018
  • 通讯作者: 叶树亮
  • 作者简介:侯德鑫(1983—),男,硕士,实验师,dexin_hou@163.com
  • 基金资助:
    浙江省自然科学基金项目(LY18F030011)

Abstract:

Graphite film is widely used in heat dissipation of heat-generating devices in electronic equipment. In-plane thermal conductivity is the key parameter which describes the heat transfer performance. However, currently only the graphite bare material data is provided in the industry, and the glued graphite film cannot be tested. It brings great inconvenience to thermal design and product quality management. In this paper, a thermal imaging-based steady-state test method for the thermal conductivity of glued graphite film is proposed. The sample is directly adhered to the flat surface which is heated by electric heating film. The temperature gradient is integrated along a loop to eliminate the influence of non-uniform thermal flow, and the thermal loss on the surface and bypass are reduced by calibration. Experiments based on a variety of glued graphite film products and metal sheets with reference data verified the validity of the method. The comparison between the test data of the glued graphite film and the bare graphite material parameters showed that great difference may exist, indicating that the nominal performance and actual performance of the graphite film product may be significantly different, and that test on glued graphite film rather than bare material is necessary.

Key words: graphite film, thermal conductivity, thermal imaging, loop integration, thermal loss calibration, steady state, heat transfer, composites

摘要:

导热石墨膜广泛用于电子设备中的发热器件散热,面向热导率是反映其传热性能的关键参数,但目前行业中一般只提供裸材数据,无法对背胶石墨膜进行测试,给石墨膜用户的热设计和产品质量管理带来不便。提出一种基于热成像的背胶石墨膜面向热导率稳态测试方法,样品直接黏附于平整台面测试,通过温度梯度环路积分消除热流不均匀的影响,通过热损失标定减小表面换热和旁路传热带来的测试误差。基于多种规格石墨膜产品和具有参考数据的金属薄片进行实验,结果证明了方法的有效性。背胶石墨膜测试数据和裸材参数的比较表明二者有很大偏差,表明石墨膜产品标称参数和实际参数可能有较大偏差,应用中需直接测试背胶石墨膜参数。

关键词: 石墨膜, 热导率, 热成像, 环路积分, 热损失标定, 稳态, 传热, 复合材料

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