Characterization of properties and thermal conductivity enhancement of activated carbonized peach gum-based composite phase change materials

doi:10.11949/0438-1157.20250503

Abstract

Abstract:

In order to improve the thermal conductivity of phase change materials, activated carbonized peach gum was prepared by a one-step chemical activation method using peach gum as the carbon source and potassium hydroxide as the activator. KOH-activated peach gum carbon (CPGK) and unactivated peach gum carbon (CPG) were added to a palmitic acid (PA)-stearic acid (SA) binary mixture, respectively. The mechanism of the activation treatment on improving the thermal properties of the binary mixture was investigated. The results show that there is only a physical bond between the additive and the PCMs. When the mass fraction of additives is 5%, the thermal conductivity of CPGK on the composite phase change material is more obvious, and the thermal conductivity of PA-SA/CPGK is 0.3528 W·m^-1·K^-1was 0.92% and 22.46% higher than that of PA-SA/CPG and PA-SA, respectively, because the pore structure of CPGK could provide more heat conduction paths. Compared with the PA-SA mixture, the melting time of PA-SA/CPGK was shortened by 53.64% and the solidification time was shortened by 11.39%. PA-SA/CPGK has a better thermal and shape stability, the mass loss of PA-SA/CPGK was reduced by 2.37% compared with that of PA-SA/CPG under the same test conditions, and the complete leakage time of PA-SA/CPGK was extended by 5.26% compared with that of PA-SA/CPG. The prepared composite phase change materials have good thermal properties and have broad application prospects in the fields of solar thermal utilization and thermal energy storage.

Key words: activation, composit phase, change material, thermal properties, heat conduction, thermal conductivity, enthalpy

摘要：

为改善相变材料的导热性能，以桃胶为碳源、氢氧化钾（KOH）为活化剂，采用一步化学活化法制备了活化桃胶碳。在棕榈酸（PA）-硬脂酸（SA）二元混合物中分别加入KOH活化桃胶碳（CPGK）和未经活化的桃胶碳（CPG），研究了活化处理对提高二元混合物热性能的影响机制。结果表明，添加剂与相变材料之间仅为物理结合。当添加剂质量分数为5%时，CPGK对复合相变材料导热性能的提升更为明显，PA-SA/CPGK热导率为0.3528 W·m^-1·K^-1，分别较PA-SA/CPG及PA-SA提高0.92%、22.46%，这是由于CPGK的孔隙结构能提供更多热传导路径。相比于PA-SA混合物，PA-SA/CPGK的熔化时间最大缩短了53.64%，凝固时间最大缩短了11.39%。PA-SA/CPGK较PA-SA/CPG具有更好的热稳定性及形状稳定性，相同测试条件下，PA-SA/CPGK的质量损失比PA-SA/CPG减小2.37%，PA-SA/CPGK的完全泄漏时间较PA-SA/CPG延长5.26%。所制备的复合相变材料具有良好的热性能，在太阳能热利用和热能储存等领域具有广阔应用前景。

关键词: 活化, 复合相变材料, 热物性, 热传导, 热导率, 焓

CLC Number:

TK 02

Shengqiang YIN, Xiangyu ZHONG, Manyu GONG, Lu LI, Yuanzheng LIU, Shoubin ZHOU, Junbing XIAO, Changhui LIU, Chuankun JIA. Characterization of properties and thermal conductivity enhancement of activated carbonized peach gum-based composite phase change materials[J]. CIESC Journal, 2025, 76(12): 6614-6625.

尹胜强, 钟湘宇, 龚漫雨, 李露, 刘远征, 周寿斌, 肖俊兵, 刘昌会, 贾传坤. 活化桃胶碳基复合相变材料性能表征及导热增强研究[J]. 化工学报, 2025, 76(12): 6614-6625.

Figures/Tables 10

References 38

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材料	密度/(g⋅cm^-3)	纯度/%	熔化温度/℃
棕榈酸	0.85	98.00	62.50
硬脂酸	0.84	98.37	71.70
氢氧化钾	2.04	AR	—

材料	密度/(g⋅cm^-3)	纯度/%	熔化温度/℃
棕榈酸	0.85	98.00	62.50
硬脂酸	0.84	98.37	71.70
氢氧化钾	2.04	AR	—

CPG质量分数	熔化过程		凝固过程		CPGK质量分数	熔化过程		凝固过程
CPG质量分数	ΔT_m/℃	h_m/(J·g^-1)	ΔT_c/℃	h_c/(J·g^-1)	CPGK质量分数	ΔT_m/℃	h_m/(J·g^-1)	ΔT_c/℃	h_c/(J·g^-1)
0	[56.10,60.68]	186.4	[45.13,52.29]	186.1	0	[56.10,60.68]	186.4	[45.13,52.29]	186.1
0.01	[56.60,62.34]	183.1	[43.53,51.73]	181.6	0.01	[55.30,62.63]	180.8	[43.07,52.04]	175.4
0.02	[55.68,60.56]	171.6	[44.74,52.02]	169.8	0.02	[55.52,60.88]	175.4	[44.17,51.56]	172.7
0.03	[56.31,62.25]	170.0	[43.45,52.33]	168.8	0.03	[54.78,61.76]	170.3	[43.24,51.90]	169.9
0.04	[55.65,62.97]	169.0	[43.67,53.23]	168.2	0.04	[55.38,62.21]	169.4	[43.31,52.27]	169.1
0.05	[55.83,59.04]	166.0	[46.51,53.24]	164.2	0.05	[55.02,62.76]	165.5	[42.67,51.23]	165.2

CPG质量分数	熔化过程		凝固过程		CPGK质量分数	熔化过程		凝固过程
CPG质量分数	ΔT_m/℃	h_m/(J·g^-1)	ΔT_c/℃	h_c/(J·g^-1)	CPGK质量分数	ΔT_m/℃	h_m/(J·g^-1)	ΔT_c/℃	h_c/(J·g^-1)
0	[56.10,60.68]	186.4	[45.13,52.29]	186.1	0	[56.10,60.68]	186.4	[45.13,52.29]	186.1
0.01	[56.60,62.34]	183.1	[43.53,51.73]	181.6	0.01	[55.30,62.63]	180.8	[43.07,52.04]	175.4
0.02	[55.68,60.56]	171.6	[44.74,52.02]	169.8	0.02	[55.52,60.88]	175.4	[44.17,51.56]	172.7
0.03	[56.31,62.25]	170.0	[43.45,52.33]	168.8	0.03	[54.78,61.76]	170.3	[43.24,51.90]	169.9
0.04	[55.65,62.97]	169.0	[43.67,53.23]	168.2	0.04	[55.38,62.21]	169.4	[43.31,52.27]	169.1
0.05	[55.83,59.04]	166.0	[46.51,53.24]	164.2	0.05	[55.02,62.76]	165.5	[42.67,51.23]	165.2