Depositing mechanism of selective OSP on copper and gold surface of PCB board

doi:10.11949/j.issn.0438-1157.20170498

Abstract

Abstract:

In order to develop better Cu-Au selective OSP (organic solderability preservatives),the procedure and principle of depositing of several selective OSP on printed circuit board(PCB) were studied for the first time. The mechanism of OSP reaction and selective depositing were investigated with UV thickness measure,SEM morphology survey and EDS element-composing analysis. The results indicate that the complexation reaction between substituted benzimidazole derivatives and copper (Ⅰ) compound needs some activation energy. The copper (Ⅱ) ion,ferric (Ⅲ) ion and benzimidazole all can lower this activation energy and have positive catalytic effect,while the zinc (Ⅱ) ion has no such capacity. Employing the catalytic property and no participating in OSP film formation of the ferric ion can endow OSP the selectivity between copper and gold. And no complexation between benzimidazole and gold atom can also be used to make this kind of selectivity as well. The selective OSP containing zinc ion plus pre-treatment process is obviously better than the selective OSP containing ferric ion. The OSP film formation procedure does not change the surface morphology of copper and gold.

Key words: catalysis, chemical reaction, complexes, deposition, selective, organic solderability preservatives, substituted benzimidazole derivatives

摘要：

通过紫外分析有机可焊保护剂（OSP）膜厚、SEM形貌观察和EDS元素分析等方法研究了不同OSP工艺流程对印制电路板铜金选择性沉积的过程和机理。结果表明：取代苯并咪唑衍生物和1价铜化合物的OSP配合反应需要一定的活化能；2价铜离子、3价铁离子以及苯并咪唑小分子均可以降低该反应的活化能，具有正向催化作用，而锌离子不具备催化OSP反应的能力；利用铁离子的催化特性和不参与成膜的特点可以使OSP在铜、金之间形成选择性，利用苯并咪唑小分子不与金原子络合的特点也可以使OSP在铜、金之间形成选择性；配套预浸前处理的含锌离子OSP体系的选择性显著优于含铁离子OSP体系的选择性；OSP成膜反应不会改变铜表面和金表面的微观形貌。

关键词: 催化, 化学反应, 配合物, 沉积物, 选择性, 有机可焊保护剂, 取代苯并咪唑衍生物

CLC Number:

TQ028.8

XIAO Dingjun, ZHAO Mingyu, YE Shaoming, LI Xiaofang, WANG Chong. Depositing mechanism of selective OSP on copper and gold surface of PCB board[J]. CIESC Journal, 2017, 68(S1): 232-239.

肖定军, 赵明宇, 叶绍明, 黎小芳, 王翀. 选择性有机可焊保护剂在印制电路板铜金表面选择性沉积机理[J]. 化工学报, 2017, 68(S1): 232-239.

References 20

[1]	陈世金,罗旭,覃新,等. 选择性ENIG+OSP工艺中金面上膜之解困[J]. 印制电路信息,2012,(S1):438-442. CHEN S J,LUO X,QIN X,et al. The solution for preservative on gold surface of selective ENIG+OSP process technology[J]. Printed Circuit Information,2012,(S1):438-442.
[2]	林金堵. 有机可焊性保护剂的现状与未来[J]. 印制电路信息,2008,(11):44-47. LIN J D. The present and future of organic solderability preservative[J]. Printed Circuit Information,2008,(11):44-47.
[3]	KIM H J,PAIK K W. Adhesion and reliability of anisotropic conductive films (ACFs) joints on organic solderability preservatives (OSPs) metal surface finish[J]. Journal of Electronic Materials,2008,37(7):1003-1011.
[4]	丁志廉. 取代表面涂(镀)覆而改进的有机可焊性保护剂[J]. 印制电路信息,2005,(1):53-57. DING Z L. Improved organic solderability preservatives(OSPs) for surface finishes[J]. Printed Circuit Information,2005,(1):53-57.
[5]	YOSHIDA S J,ISHIDA H. An investigation of the thermal stability of undecylimidazole on copper by FT-IR reflection absorption spectroscopy[J]. Appl. Surf. Sci.,1995,89(1):39-47.
[6]	HUYNH N,BOTTLE S E,NOTOYA T,et al. Inhibitive action of the octyl esters of 4-and 5-carboxybenzotriazole for copper corrosion in sulphate solutions[J]. Corrosion Science,2000,42:259-274.
[7]	赵永生,庞正智,卢艳华. 咪唑化合物在铜表面的成膜机理[J]. 化工学报,2004,55(4):659-663. ZHAO Y S,PANG Z Z,LU Y H. Mechanism of film forming for imidazole and its derivatives on surface of copper[J]. Journal of Chemical Industry and Engineering (China),2004,55(4):659-663.
[8]	赵永生,庞正智. 咪唑化合物在铜表面的成膜过程与机理[J]. 材料保护,2003,36(12):17-19. ZHAO Y S,PANG Z Z. Film forming mechanism of imidazole on copper surface[J]. Materials Protection,2003,36(12):17-19.
[9]	陈世金. 选择性OSP中异色问题的研究和改善[J]. 印制电路信息,2012,(2):59-63. CHEN S J. The research and improvent of different color defect for selective OSP board[J]. Printed Circuit Information,2012,(2):59-63.
[10]	WENGENROTH K F. Process for selective deposition of OSP coating on copper,excluding deposition on gold:US6524644 B1[P].2003-02-25.
[11]	黎小芳,赵明宇,肖定军,等. 高选择性有机可焊保护剂的研究[J]. 印制电路信息,2015,(7):45-47. LI X F,ZHAO M Y,XIAO D J,et al. Study of water soluble organic solderability preservatives[J]. Printed Circuit Information,2015,(7):45-47.
[12]	白蓉生. 表面混用的OSP有机保焊剂——介绍对金层、焊锡层或其他表面不致干扰的OSP处理[J]. 印制电路资讯,2005,(6):11-16. BAI R S. Surface mixed OSP organic solder protection-the OSP treatment of gold layer,solder layer or other surface is introduced[J]. Printed Circuit Board Information,2005,(6):11-16.
[13]	聂锦华,肖志勇,何自立. 复合表面处理贾凡尼效应的研究[J].印制电路信息,2013,(9):40-42. NIE J H,XIAO Z Y,HE Z L. Research on the Galvanic effect of composite surface treatment[J]. Printed Circuit Information,2013,(9):40-42.
[14]	赵永生,史志龙,曾照坤,等. 铜表面2-芳基苯并咪唑铜配合物膜结构及其热稳定性研究[J]. 材料保护,2003,36(4):29-31. ZHAO Y S,SHI Z L,ZENG Z K,et al. Structures and thermal stabilities of 2-arylbenzimidazoles[J]. Materials Protection,2003,36(4):29-31.
[15]	沈建,庞正智,余鼎声,等. 2-取代苯并咪唑在铜表面的成膜过程研究[J]. 北京化工大学学报,2004,31(4):53-55. SHEN J,PANG Z Z,YU D S,et al. Formation of 2-substituted-benzimidazole film on copper surface[J]. Journal of Beijing University of Chemical Technology,2004,31(4):53-55.
[16]	吴永炘. 唑类铜缓蚀剂在OSP应用的研究[C]//2003中国电子制造技术论坛会论文集. 2003:208-211. WU Y X. Study on application of azole copper corrosion inhibitor in OSP[C]//Proceedings of China Forum on Electronic Manufacturing Technology. 2003:208-211.
[17]	CARANO M. The evolution of organic solderability preservatives (OSP) from a temporary protectant to a leadership position in surface finishing chemistry[J]. Circuit World,2011,37(2):12-19.
[18]	龚淼.选择性OSP工艺中贾凡尼效应解决方案[J]. 印制电路资讯,2011,(4):4. GONG M. Solution of Galvanic effect of selective OSP process[J]. Printed Circuit Board Information,2011,(4):4.
[19]	李卫明,冼日华,刘彬云,等. 新型苯并咪唑衍生物的合成[J]. 化学试剂,2011,33(1):75-77. LI W M,XIAN R H,LIU B Y,et al. Synthesis of new type of benzimidazole derivatives[J]. Chemical Reagents,2011,33(1):75-77.
[20]	林原标.有机保焊剂预浸处理剂及有机保焊膜成形方法:101508051A[P]. 2009-08-19. LIN Y B. Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method:101508051A[P]. 2009-08-19.