[1] |
Congqi HUANG, Yimei WU, Jianye CHEN, Shuangquan SHAO.
Simulation study of thermal management system of alkaline water electrolysis device for hydrogen production
[J]. CIESC Journal, 2023, 74(S1): 320-328.
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[2] |
Yifan JIANG, Lei LIU, Yao ZHAO, Yanjun DAI.
Research on the performance of liquid cooling system for UVLED optical components
[J]. CIESC Journal, 2023, 74(S1): 154-160.
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[3] |
Shuangxing ZHANG, Fangchen LIU, Yifei ZHANG, Wenjing DU.
Experimental study on phase change heat storage and release performance of R-134a pulsating heat pipe
[J]. CIESC Journal, 2023, 74(S1): 165-171.
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[4] |
Limei SHEN, Boxing HU, Yufei XIE, Weihao ZENG, Xiaoyu ZHANG.
Experimental study on heat transfer performance of ultra-thin flat heat pipe
[J]. CIESC Journal, 2023, 74(S1): 198-205.
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[5] |
Yanpeng WU, Qianlong LIU, Dongmin TIAN, Fengjun CHEN.
A review of coupling PCM modules with heat pipes for electronic thermal management
[J]. CIESC Journal, 2023, 74(S1): 25-31.
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[6] |
Fangzhe SHI, Yunhua GAN.
Numerical simulation of start-up characteristics and heat transfer performance of ultra-thin heat pipe
[J]. CIESC Journal, 2023, 74(7): 2814-2823.
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[7] |
Xuehong WU, Linlin LUAN, Yanan CHEN, Min ZHAO, Cai LYU, Yong LIU.
Preparation and thermal properties of degradable flexible phase change films
[J]. CIESC Journal, 2023, 74(4): 1818-1826.
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[8] |
Huizhu YANG, Jingling LAN, Yue YANG, Jialin LIANG, Chuanwen LYU, Yonggang ZHU.
Experimental study on thermal performance of high power flat heat pipe
[J]. CIESC Journal, 2023, 74(4): 1561-1569.
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[9] |
Jianglong DU, Wenqi YANG, Kai HUANG, Cheng LIAN, Honglai LIU.
Heat dissipation performance of the module combined CPCM with air cooling for lithium-ion batteries
[J]. CIESC Journal, 2023, 74(2): 674-689.
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[10] |
Jianxun CHEN, Jinping LIU, Xiongwen XU, Yinhao YU.
Numerical simulation and performance optimization of a new loop gravity heat pipe
[J]. CIESC Journal, 2023, 74(2): 721-734.
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[11] |
Jinjia WEI, Lei LIU, Xiaoping YANG.
Research progress of loop heat pipes for heat dissipation of high-heat-flux electronic devices
[J]. CIESC Journal, 2023, 74(1): 60-73.
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[12] |
Bin DONG, Yonghao XUE, Kunfeng LIANG, Zhengyin YUAN, Lin WANG, Xun ZHOU.
Experimental study on spray heat transfer characteristics of microencapsulated phase change material suspension
[J]. CIESC Journal, 2022, 73(7): 2971-2981.
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[13] |
Miao ZHANG, Honghai YANG, Yong YIN, Yue XU, Junjie SHEN, Xincheng LU, Weigang SHI, Jun WANG.
Start-up and heat transfer characteristics of a pulsating heat pipe with graphene oxide nanofluids
[J]. CIESC Journal, 2022, 73(3): 1136-1146.
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[14] |
Jiateng ZHAO, Chenhui WU, Yucheng DAI, Zhonghao RAO.
Research progress on heat transfer enhancement and application of oscillating heat pipe
[J]. CIESC Journal, 2022, 73(2): 535-565.
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[15] |
Keqing ZHENG, Ya SUN, Yangtian YAN, Li LI, Jun YANG.
Numerical simulation of novel SOFC interconnector with thermoelectric co-enhancement
[J]. CIESC Journal, 2022, 73(12): 5572-5580.
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