Research on the performance of liquid cooling system for UVLED optical components

doi:10.11949/0438-1157.20221634

Abstract

Abstract:

With the development of light source technology, UVLED optical components are widely used in various fields. It is very important to ensure the temperature of UVLED optical components within a safe range. In this paper, the liquid cooling system for UVLED was studied by experiment and simulation, and four kinds of liquid cooling plates with different flow channels were designed. In the case of heat flux of 2.2 W/cm², the surface temperature and inlet and outlet pressure drop of the liquid cooling plate were tested experimentally, and the heat transfer and flow performance of the liquid cooling plate were studied by numerical simulation. The results show that the relative error between the experimental and simulation results is 3%. When the liquid cooling working medium is heat conduction oil, the temperature distribution of the six-sided flow channel liquid cooling plate is the most uniform and the temperature control effect is the best. When the flow rate is 2.5 L/min, the highest temperature is 49.7℃, and the DC flow channel plate surface temperature difference is the largest, but the lowest pressure drop is only 5.34 kPa.

Key words: UVLED, thermal management, fluid-cooling plate, cooling system

摘要：

随着光源技术的发展，UVLED光学元件被广泛应用于各个领域，保证UVLED光学元件的温度在安全范围内至关重要。对应用于UVLED的液冷散热系统进行实验与仿真研究，设计了六边型、直流型、U型、蛇型，四种不同流道的液冷板。在热通量为2.2 W/cm²的情况下，实验测试液冷板的换热面温度，并通过数值仿真研究其传热及流动性能。结果表明：实验与仿真结果的相对误差为3%，其中液冷工质为导热油时，六边型流道液冷板的温度分布最均匀且温控效果最好，流量为2.5 L/min时，最高温度为49.7℃，直流型流道板面温差最大但压降最低仅为5.34 kPa。

关键词: UVLED, 热管理, 液冷板, 散热系统

CLC Number:

TK-9

Yifan JIANG, Lei LIU, Yao ZHAO, Yanjun DAI. Research on the performance of liquid cooling system for UVLED optical components[J]. CIESC Journal, 2023, 74(S1): 154-160.

蒋祎璠, 刘蕾, 赵耀, 代彦军. UVLED光学元件液冷散热系统性能研究[J]. 化工学报, 2023, 74(S1): 154-160.

Figures/Tables 14

Fig.1 UVLED optical component liquid cooling system schematic

Fig.2 Snake type, hexagon type, U type, DC type liquid cooling plate flow design

Fig.3 Liquid cooling cooling system test bench

Fig.4 Schematic diagram of liquid cooling module structure

Fig.5 Simulation of maximum temperature of liquid cooling plate-experimental results

Fig.6 Maximum temperature of heat exchange surface of liquid cooling plate - flow rate

Fig.7 Pressure drop at inlet and outlet of liquid cooling plate - flow rate

Fig.8 Maximum temperature difference on heat exchange surface of liquid cooling plate - flow rate

Fig.9 Liquid cooling plate thermal resistance - flow rate

Fig.10 Heat transfer coefficient of liquid cooled plate - flow rate

Fig.11 Performance evaluation results of liquid cooled plate

Fig.12 Maximum temperature of DC liquid cooling plate heat exchange surface

Fig.13 Maximum temperature of heat exchange surface of hexagon liquid cooling plate

Fig.14 Pressure drop at inlet and outlet of liquid cooling plate-flow rate

References 32

1	Huang J W. Design and fabrication of UVLED array aligner for proximity and soft contact exposure[C]//SPIE Advanced Lithography. San Jose, California, USA: Optical Microlithography ⅩⅩⅩⅢ, 2020, 11327: 256-266.
2	陈颖聪, 文尚胜, 吴玉香. 基于塑料散热器无基板板上芯片封装的LED热分析[J]. 光学学报, 2013, 33(8): 231-236.
	Chen Y C, Wen S S, Wu Y X. Thermal analysis for LED chipon board package based on plastic radiator without substrate[J]. Acta Optica Sinica, 2013, 33(8): 231-236.
3	Zhao X J, Cai Y X, Wang J, et al. Thermal model design and analysis of the high-power LED automotive headlight cooling device[J]. Applied Thermal Engineering, 2015, 75: 248-258.
4	Cheng H C. On the thermal characterization of an RGB LED-based white light module[J]. Applied Thermal Engineering, 2012, 38: 105-116.
5	勾昱君. 大功率LED热管散热器传热强化研究[D]. 北京: 北京工业大学, 2014.
	Gou Y J. An investigation on heat transfer augmentation of large power LED heat pipe radiators[D]. Beijing: Beijing University of Technology, 2014.
6	Lai Y. Liquid cooling of bright LEDs for automotive applications[J]. Applied Thermal Engineering, 2009, 29(5/6): 1239-1244.
7	Hamida M B B, Hatami M. Optimization of fins arrangements for the square light emitting diode (LED) cooling through nanofluid-filled microchannel[J]. Scientific Reports, 2021, 11: 12610.
8	Bao Y C, Cai Y X, Wang J, et al. Experimental study on LED heat dissipation based on enhanced corona wind by graphene decoration[J]. IEEE Transactions on Plasma Science, 2019, 47(8): 4121-4126.
9	Delendik K, Kolyago N, Voitik O. Investigation of cooling system on the base of heat pipes for high-power LEDs[J]. AIP Conference Proceedings, 2019, 2116(1): 030013.
10	李红传, 纪献兵, 郑晓欢, 等. 并行多通道大功率LED回路热管散热器[J]. 光电子·激光, 2015, 26(1): 48-53.
	Li H C, Ji X B, Zheng X H, et al. Loop heat pipe radiator with parallel multi-channel for high power LED[J]. Journal of Optoelectronics·Laser, 2015, 26(1): 48-53.
11	Wang J, Cai Y X, Bao Y C, et al. Enhanced ionic wind generation by graphene for LED heat dissipation[J]. International Journal of Energy Research, 2019, 43(8): 3746-3755.
12	Wang H, Qu J, Peng Y Q, et al. Heat transfer performance of a novel tubular oscillating heat pipe with sintered copper particles inside flat-plate evaporator and high-power LED heat sink application[J]. Energy Conversion and Management, 2019, 189: 215-222.
13	Lin X H, Mo S P, Jia L S, et al. Experimental study and Taguchi analysis on LED cooling by thermoelectric cooler integrated with microchannel heat sink[J]. Applied Energy, 2019, 242: 232-238.
14	Seo J H. Illuminance and heat transfer characteristics of high power LED cooling system with heat sink filled with ferrofluid[J]. Applied Thermal Engineering, 2018, 143: 438-449.
15	温达旸, 赵荣超, 叶鸣, 等. 基于非均匀翅片液冷板的电池热管理性能研究[J]. 电源技术, 2021, 45(10): 1264-1268.
	Wen D Y, Zhao R C, Ye M, et al. Study of batteries thermal management performance based on liquid cooling plate with non-uniform pin fins[J]. Chinese Journal of Power Sources, 2021, 45(10): 1264-1268.
16	周蔚南, 孙钦, 关胜利, 等. 扰流空心翅片式微流道液冷板流动换热特性研究[J]. 新能源进展, 2021, 9(6): 506-512.
	Zhou W N, Sun Q, Guan S L, et al. Liquid flow and heat transfer characteristics of liquid cooling plate with hollow-fin[J]. Advances in New and Renewable Energy, 2021, 9(6): 506-512.
17	姚泽民. 功率型LED散热器结构热分析与优化设计[D]. 广州: 华南理工大学, 2013.
	Yao Z M. Thermal analysis and optimized design for high power LED heat sink structure[D]. Guangzhou: South China University of Technology, 2013.
18	李海超, 李晋尧, 徐靖翔, 等. 基于大功率LED-UV固化系统散热装置的研究[J]. 北京印刷学院学报, 2019, 27(5): 95-98.
	Li H C, Li J Y, Xu J X, et al. Research on heat sink based on high power LED-UV curing system[J]. Journal of Beijing Institute of Graphic Communication, 2019, 27(5): 95-98.
19	倪笠, 崔晓钰, 马柯. 大功率UV-LED固化灯水冷散热器[J]. 光电子技术, 2016, 36(2): 130-134.
	Ni L, Cui X Y, Ma K. A liquid cold plate for high power UV-LED curing lamps[J]. Optoelectronic Technology, 2016, 36(2): 130-134.
20	韦士腾, 徐尚龙, 赵新年. LED液冷设计及其小型化控制系统研究[J]. 电子机械工程, 2022, 38(1): 35-39, 44.
	Wei S T, Xu S L, Zhao X N. Research on LED liquid cooling design and its miniaturization control system[J]. Electro-Mechanical Engineering, 2022, 38(1): 35-39, 44.
21	Tuckerman D B, Pease R F W. High-performance heat sinking for VLSI[J]. IEEE Electron Device Letters, 1981, 2(5): 126-129.
22	Skandakumaran P, Ortega A, Jamal-Eddine T, et al. Multi-layered SiC microchannel heat sinks - modeling and experiment[C]//The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems. Las Vegas, NV, USA: IEEE, 2004: 352-360.
23	Petroski J. Understanding longitudinal fin heat sink orientation sensitivity for light emitting diode (LED) lighting applications[C]//2003 International Electronic Packaging Technical Conference and Exhibition. 2003. Maui, Hawaii, USA: ASMEDC, 2003.
24	Zhang Y P. Thermal performance study of integrated cold plate with power module[J]. Applied Thermal Engineering, 2009, 29(17/18): 3568-3573.
25	Xie X L. Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink[J]. Applied Thermal Engineering, 2009, 29(1): 64-74.
26	Garg H, Negi V S, Wadhwa A S, et al. Numerical analysis of different shapes of microchannel for miniature cooling system[C]//2014 Recent Advances in Engineering and Computational Sciences (RAECS). Chandigarh, India: IEEE, 2014.
27	Sharma C S. A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: an experimental study[J]. International Journal of Heat and Mass Transfer, 2015, 88: 684-694.
28	Bi C. Heat transfer enhancement in mini-channel heat sinks with dimples and cylindrical grooves[J]. Applied Thermal Engineering, 2013, 55(1/2): 121-132.
29	Ijam A, Saidur R, Ganesan P, et al. Cooling of minichannel heat sink using nanofluids[J]. International Communications in Heat and Mass Transfer, 2012, 39(8): 1188-1194.
30	Khoshvaght-Aliabadi M, Nozan F. Water cooled corrugated minichannel heat sink for electronic devices: effect of corrugation shape[J]. International Communications in Heat and Mass Transfer, 2016, 76: 188-196.
31	Pence D. Reduced pumping power and wall temperature in microchannel heat sinks with fractal-like branching channel networks[J]. Microscale Thermophysical Engineering, 2003, 6(4): 319-330.
32	Cao H S. Optimization design of microchannel heat sink geometry for high power laser mirror[J]. Applied Thermal Engineering, 2010, 30(13): 1644-1651.

[1]	Congqi HUANG, Yimei WU, Jianye CHEN, Shuangquan SHAO. Simulation study of thermal management system of alkaline water electrolysis device for hydrogen production [J]. CIESC Journal, 2023, 74(S1): 320-328.
[2]	Keqing ZHENG, Ya SUN, Yangtian YAN, Li LI, Jun YANG. Numerical simulation of novel SOFC interconnector with thermoelectric co-enhancement [J]. CIESC Journal, 2022, 73(12): 5572-5580.
[3]	Ming PENG, Qiangfeng XIA, Lixiang JIANG, Ruiyuan ZHANG, Lingyi GUO, Li CHEN, Wenquan TAO. Study on the effect of gas channel arrangement on the performance of air-cooled fuel cells [J]. CIESC Journal, 2022, 73(10): 4625-4637.
[4]	LIANG Kunfeng, WANG Moran, GAO Meijie, LYU Zhenwei, XU Hongyu, DONG Bin, GAO Fengling. Thermodynamic analysis of performance of integrated thermal management system for pure electric vehicle [J]. CIESC Journal, 2021, 72(S1): 494-502.
[5]	SHAN He, MA Qiuming, PAN Quanwen, CAO Weiliang, WANG Qiang, WANG Ruzhu. Simulation of heat transfer performance in the coolant side of a novel chiller for electric vehicles thermal management system [J]. CIESC Journal, 2021, 72(S1): 194-202.
[6]	MA Qiuming, NIE Lei, PAN Quanwen, SHAN He, CAO Weiliang, WANG Qiang, WANG Ruzhu. Heat exchange performance of a battery chiller for electric vehicles [J]. CIESC Journal, 2021, 72(S1): 170-177.
[7]	Kunfeng LIANG, Guoqiang MI, Hongyu XU, Chunyan GAO, Bin DONG, Yachao LI, Moran WANG. Performance analysis and optimization of two-way thermal management system for power battery [J]. CIESC Journal, 2021, 72(8): 4146-4154.
[8]	Desheng MA, Liping PANG, Xiaodong MAO, Sujun DONG. Thermal management of airborne integrated environmental control system [J]. CIESC Journal, 2020, 71(S1): 436-440.
[9]	Huicai MA, Yiling LIU, Xiaomin DANG. Configuration analysis of integrated thermal management about high altitude long-endurance unmanned aerial vehicle [J]. CIESC Journal, 2020, 71(S1): 417-424.
[10]	Rong A, Liping PANG, Dongsheng YANG, Bin QI. Design and optimization of integrated thermal management system for high-speed aircraft [J]. CIESC Journal, 2020, 71(S1): 315-321.
[11]	Qiang ZHAO, Hang GUO, Fang YE, Chongfang MA. State of the art of flow field plates of proton exchange membrane fuel cells [J]. CIESC Journal, 2020, 71(5): 1943-1963.
[12]	Hongbo ZHAO, Jie LIU, Biao MA, Qiang GUO, Xiaohui LIU, Fengwen PAN. Control strategy and simulation research of water-cooled PEMFC thermal management system [J]. CIESC Journal, 2020, 71(5): 2139-2150.
[13]	SHI Shang, YU Jianzu, CHEN Mengdong, GAO Hongxia, XIE Yongqi. Battery thermal management system using phase change materials and foam copper [J]. CIESC Journal, 2017, 68(7): 2678-2683.
[14]	CHEN Sitong, LI Weiwei, WANG Xueke, WANG Shubo, XIE Xiaofeng, ZHU Tong. Thermal management using phase change materials for proton exchange membrane fuel cells [J]. CIESC Journal, 2016, 67(S1): 1-6.
[15]	GUO Minchen, JI Zhiqin, AN Guangran, LI Ansheng. Thermal economy analysis of power unit with wet-dry hybrid cooling system [J]. CIESC Journal, 2015, 66(1): 433-440.