化工学报 ›› 2014, Vol. 65 ›› Issue (z2): 33-37.DOI: 10.3969/j.issn.0438-1157.2014.z2.005

• 热力学 • 上一篇    下一篇

镍热导率的分子动力学模拟

辛公明1, 祁金胜2, 李鑫1, 王怡飞1, 季万祥1, 程林1   

  1. 1. 山东大学热科学与工程研究中心, 山东 济南 250061;
    2. 山东电力工程咨询院有限公司, 山东 济南 250013
  • 收稿日期:2014-08-25 修回日期:2014-09-05 出版日期:2014-12-30 发布日期:2014-12-30
  • 通讯作者: 程林
  • 基金资助:

    国家自然科学基金项目(51106089);国家重点基础研究发展计划项目(2013CB228305)。

Molecular dynamics simulation of Ni thermal conductivity

XIN Gongming1, QI Jinsheng2, LI Xin1, WANG Yifei1, JI Wanxiang1, CHENG Lin1   

  1. 1. Institute of Thermal Science and Technology, Shandong University, Jinan 250061, Shandong, China;
    2. Shandong Electric Power Engineering Consulting Institute Corp., Ltd., Jinan 250013, Shandong, China
  • Received:2014-08-25 Revised:2014-09-05 Online:2014-12-30 Published:2014-12-30
  • Supported by:

    supported by the National Natural Science Foundation of China(51106089) and the National Basic Research Program of China(2013CB228305).

摘要:

热导率的求解及优化具有重要的研究价值和实际意义,分子动力学是计算体系热力学量和其他宏观性质的一种有效方法。采用一种基于均匀内热源的非平衡分子动力学(NEMD)方法,分别选取Lennard-Jones势能模型和EAM势能模型,对镍的热导率进行模拟,对比二者结果发现考虑了电子影响的EAM势能模型比L-J模型更接近获得与实际值吻合良好的结果。继续选取EAM模型对铜以及镍铜复合材料的热导率进行模拟分析,进一步验证了EAM势能模型对金属铜热导率的模拟可行性,同时模拟分析了不同配比的镍铜复合材料的热导率,为获得最低有效热导率值及其配比进行了初步模拟分析并提供了理论支撑。

关键词: 分子模拟, 模型, 热物性, 镍, 铜, 热导率

Abstract:

The investigations of thermal conductivity of materials are important to understand their characteristics and their influences. In simulation-based studies, many researchers used molecular dynamics (MD) simulation to analyze the thermodynamic properties. In this paper, non-equilibrium molecular dynamics (NEMD) simulations based on uniform internal heat source are performed to determine the thermal conductivity of nickel material by using Lenard-Jones potential model and EAM potential model. Simulation results based on different potential models are achieved and analyzed. Based on this, the thermal conductivity of copper and nickel-copper solid solution were simulated. The EAM potential model was further validated by achieving reasonable results for copper. And the optimized Ni-Cu ratio for lower thermal conductivity of solid solution were modeled based on the EAM model.

Key words: molecular simulation, model, thermodynamic properties, nickel, copper, thermal conductivity

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