歧管式射流微通道液冷散热性能研究

doi:10.11949/0438-1157.20231228

摘要/Abstract

摘要：

随着信息技术进步，芯片向大面积、高功率方向发展，对热管理提出了严峻挑战。微通道液冷能够解决高功率芯片散热难题，但传统平直微通道热沉流阻大、温度均匀性差。本文提出了一种耦合歧管式进出液结构、分布式射流和微针翅的新型歧管式微通道散热器，在平均热通量高于330 W/cm²，总功率达到2500W时，芯片平均温度低于70℃，实现了高效散热。通过数值模拟发现：降低散热器射流腔高度可显著强化传热，但整体压降也随之陡升，存在一个最佳射流腔高度；散热器底板的微针翅尺寸及其与射流腔的相对尺寸是新型歧管式微通道散热器的重要结构参数，微针翅的存在并不是绝对有益于传热强化。定义了微针翅与射流腔之间相对高度的无量纲参数—翅占比，存在临界翅占比使得阻碍效应和强化效应相抵消，当翅占比高于这一临界值时，才能达到强化换热的效果。研究为新型歧管式微通道散热器的设计提供了指导。

关键词: 微通道, 传热, 数值模拟, 湍流, 计算流体力学

Abstract:

As advancements in information technology progress, chip development is moving towards large-area, high-power configurations, posing significant challenges in heat management. Microchannel liquid cooling has emerged as a viable solution to address the thermal management difficulties associated with high-power chips. Microchannel liquid cooling has emerged as a solution to address the thermal management difficulties associated with high-power chips. However, traditional straight microchannels suffer from high flow resistance and poor temperature uniformity. This paper introduces a novel manifold microchannel heat sink by incorporating a manifold inlet/outlet liquid structure, distributed jet impingement, and micro-pin fins. Under conditions where the average heat flux density exceeds 330 W/cm² and the total power reaches 2500 W, the chip's average temperature remains below 70℃, indicating that high efficiency cooling is achieved. Through numerical simulation, it is found that increasing the height of the jet impingement chamber leads to a significantly increase in heat transfer coefficient, albeit at the expense of an obvious increase in overall pressure drop. An optimum height of the jet impingement chamber is thereby identified. The dimensions of the micro-pin fins on the base plate, along with their relative proportions to the size of jet impingement chamber, emerge as critical structural parameters for the proposed microchannel heat sink. The presence of micro-pin fins does not uniformly contribute to heat transfer enhancement. A dimensionless parameter, micro-pin fin ratio, is introduced to signify the relative height between the micro-pin fins and the jet impingement chamber. A critical micro-pin fin ratio is realized by balancing the n obstructing and enhancing effects. Only when the fin ratio exceeds this critical threshold can the enhancement of heat transfer be achieved. This study provides valuable guidance for the systematic design of the novel microchannel heat sink.

Key words: microchannels, heat transfer, numerical simulation, turbulent flow, computational fluid dynamics

中图分类号:

TQ 028.8

刘帆, 张芫通, 陶成, 胡成玉, 杨小平, 魏进家. 歧管式射流微通道液冷散热性能研究[J]. 化工学报, DOI: 10.11949/0438-1157.20231228.

Fan LIU, Yuantong ZHANG, Cheng TAO, Chengyu HU, Xiaoping YANG, Jinjia WEI. Study on the performance of manifold microchannel liquid cooling[J]. CIESC Journal, DOI: 10.11949/0438-1157.20231228.

图/表 11

图1 新型歧管式微通道散热器结构示意图注:(a) 结构拆分爆炸图 (b)歧管式分流示意图 (c)冷热流体示意图

Fig.1 Schematic diagram of the novel manifold microchannel heat sink

图2 实验段结构

Fig.2 Structure of the test section

表1 新型歧管式微通道散热器数值模拟和实验测试边界条件

Table 1 Boundary conditions of the numerical simulation and experimental test of the novel manifold microchannel heat sink.

	数值模拟参数	对比实验参数
芯片面积 (mm²)	2.5×3	2.5×3
总功率 (W)	2000-2500	2500
工质	去离子水	去离子水
入口温度T_in (℃)	25	25
入口流量 G_in (L/min，简写为LPM)	1~6	1~6
流入流出分液板厚h_n(mm)	2	2
微针翅尺寸
边长d_pin（长、宽）= 间隙w_pin (μm)	100-600	200
高度h_pin(μm)	200-1200	600
射流腔尺寸
射流孔规格	5×7	5× 7
射流孔直径 (mm)	2	2
排液孔宽度 (mm)	2.5	2.5
射流腔高度h_jet(μm)	200-2400	1000

图3 几何结构示意图&网格划分方式示意图注:(a) 射流腔体及微柱尺寸示意图 (b)分布式射流腔体区域(1/4中心对称数值模拟区域) (c)分布式射流腔体区域网格

Fig.3 Schematic of geometric structure and mesh partitioning

图4 数值模拟实验对比

Fig.4 Comparison of numerical simulation and experiments

图5 芯片平均温度和压降随射流腔高度的变化规律（Gin=3 LPM，光滑表面）

Fig.5 Profile of chip average temperature and pressure drop with jet height (Gin= 3 LPM, smooth surface)

图6 射流腔速度云图和底板传热系数分布注:(a) hjet=0.2mm (b) hjet=0.4mm (c) hjet=1.8mm

Fig.6 Distribution of velocity in the jet chamber and heat transfer coefficient on the substrate

图7 射流腔高度及针翅高度对芯片平均温度的影响（ss-光滑表面；ps-针翅表面）

Fig.7 Effect of jet chamber height and micro-pinfin size on average chip temperature (ss-smooth surface; ps-pinfin surface)

图8 不同底板表面传热系数示意图注:(a) hpin/hjet=0.2,hpin=200 μm,hjet=1.0 mm;(b) ss表面,hpin=0 μm,hjet=1.0 mm;(c) hpin/hjet=0.66,hpin=200 μm,hjet=0.3 mm;(d) ss表面,hpin=0 μm,hjet=0.3 mm

Fig.8 Schematic diagram of heat transfer coefficients on different surfaces

图9 针翅边长及间距对换热性能的影响

Fig.9 Effect of pin-fin size on heat transfer performance

图10 0.4m/s速度场等值线图注:(a) 针翅边长及间距200μm完整流场图 (b) 针翅边长及间距200μm 球截面流场图(c) 针翅边长及间距500μm完整流场图 (d) 针翅边长及间距500μm 球截面流场图

Fig.10 Velocity field contour plots

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