歧管式射流微通道液冷散热性能

doi:10.11949/0438-1157.20231228

摘要/Abstract

摘要：

随着信息技术进步，芯片向大面积、高功率方向发展，对热管理提出了严峻挑战。微通道液冷能够解决高功率芯片散热难题，但传统平直微通道热沉流阻大、温度均匀性差。提出了一种耦合歧管式进出液结构、分布式射流和微针翅的新型歧管式微通道散热器，在平均热通量高于330 W/cm²、总功率达到2500 W时，芯片平均温度低于70℃，实现了高效散热。通过数值模拟发现：降低散热器射流腔高度可显著强化传热，但整体压降也随之陡升，存在一个最佳射流腔高度；散热器底板的微针翅尺寸及其与射流腔的相对尺寸是新型歧管式微通道散热器的重要结构参数，微针翅的存在并不是绝对有益于传热强化。定义了微针翅与射流腔之间相对高度的无量纲参数——翅占比，存在临界翅占比使得阻碍效应和强化效应相抵消，当翅占比高于这一临界值时才能达到强化换热效果。本研究为新型歧管式微通道散热器的设计提供了指导。

关键词: 微通道, 传热, 数值模拟, 湍流, 计算流体力学

Abstract:

As advancements in information technology progress, chip development is moving towards large-area, high-power configurations, posing significant challenges in heat management. Microchannel liquid cooling has emerged as a viable solution to address the thermal management difficulties associated with high-power chips. Microchannel liquid cooling has emerged as a solution to address the thermal management difficulties associated with high-power chips. However, traditional straight microchannels suffer from high flow resistance and poor temperature uniformity. This paper introduces a novel manifold microchannel heat sink by incorporating a manifold inlet/outlet liquid structure, distributed jet impingement, and micro-pin fins. Under conditions where the average heat flux density exceeds 330 W/cm² and the total power reaches 2500 W, the chip’s average temperature remains below 70℃, indicating that high efficiency cooling is achieved. Through numerical simulation, it is found that increasing the height of the jet impingement chamber leads to a significantly increase in heat transfer coefficient, albeit at the expense of an obvious increase in overall pressure drop. An optimum height of the jet impingement chamber is thereby identified. The dimensions of the micro-pin fins on the base plate, along with their relative proportions to the size of jet impingement chamber, emerge as critical structural parameters for the proposed microchannel heat sink. The presence of micro-pin fins does not uniformly contribute to heat transfer enhancement. A dimensionless parameter, micro-pin fin ratio, is introduced to signify the relative height between the micro-pin fins and the jet impingement chamber. A critical micro-pin fin ratio is realized by balancing the obstructing and enhancing effects. When the proportion of fins is higher than this critical value, the effect of enhanced heat transfer can be achieved. This study provides valuable guidance for the systematic design of the novel microchannel heat sink.

Key words: microchannels, heat transfer, numerical simulation, turbulent flow, computational fluid dynamics

中图分类号:

TQ 028.8

刘帆, 张芫通, 陶成, 胡成玉, 杨小平, 魏进家. 歧管式射流微通道液冷散热性能[J]. 化工学报, 2024, 75(5): 1777-1786.

Fan LIU, Yuantong ZHANG, Cheng TAO, Chengyu HU, Xiaoping YANG, Jinjia WEI. Performance of manifold microchannel liquid cooling[J]. CIESC Journal, 2024, 75(5): 1777-1786.

图/表 11

图1 新型歧管式微通道散热器结构示意图

Fig.1 Schematic diagram of novel manifold microchannel heat sink

图2 实验段结构

Fig.2 Structure of test section

表1 新型歧管式微通道散热器数值模拟和实验测试边界条件

Table 1 Boundary conditions of numerical simulation and experimental test of novel manifold microchannel heat sink

参数	数值模拟参数值	对比实验参数值
芯片面积/mm²	2.5×3	2.5×3
总功率/W	2000~2500	2500
工质	去离子水	去离子水
入口温度T_in/℃	25	25
入口流量 G_in/(L/min)	1~6	1~6
流入流出分液板厚h_n/mm	2	2
微针翅尺寸
边长d_pin（长、宽）= 间隙w_pin/μm	100~600	200
高度h_pin/μm	200~1200	600
射流腔尺寸
射流孔规格	5×7	5×7
射流孔直径/mm	2	2
排液孔宽度/mm	2.5	2.5
射流腔高度h_jet/μm	200~2400	1000
歧管层尺寸
流道高度 h_c/mm	2	2

图3 几何结构示意图和网格划分方式示意图

Fig.3 Schematic of geometric structure and mesh partitioning

图4 数值模拟与实验结果对比

Fig.4 Comparison of numerical simulation and experimental results

图5 芯片表面平均温度和压降随射流腔高度的变化规律（Gin=3 L/min，光滑表面）

Fig.5 Profile of chip average temperature and pressure drop with jet height (Gin=3 L/min, smooth surface)

图6 射流腔速度云图和底板传热系数分布云图

Fig.6 Distribution of velocity in jet chamber and heat transfer coefficient on substrate

图7 射流腔高度及针翅高度对芯片表面平均温度的影响ss—光滑表面;ps—针翅表面

Fig.7 Effect of jet chamber height and micro-pinfin size on average chip temperaturess—smooth surface; ps—pinfin surface

图8 不同底板表面传热系数示意图

Fig.8 Schematic diagram of heat transfer coefficients on different surfaces

图9 针翅边长及间距对换热性能的影响

Fig.9 Effect of pin-fin size on heat transfer performance

图10 0.4 m/s速度场等值线图

Fig.10 Velocity field contour plots

参考文献 31

1	van Erp R, Soleimanzadeh R, Nela L, et al. Co-designing electronics with microfluidics for more sustainable cooling[J]. Nature, 2020, 585: 211-216.
2	Kanduri A, Rahmani A M, Liljeberg P, et al. A perspective on dark silicon[M]//Rahmani A, Liljeberg P, Hemani A, et al. The Dark Side of Silicon. Cham: Springer, 2017: 3-20.
3	Hardavellas N, Ferdman M, Falsafi B, et al. Toward dark silicon in servers[J]. IEEE Micro, 2011, 31(4): 6-15.
4	Garimella S V, Fleischer A S, Murthy J Y, et al. Thermal challenges in next-generation electronic systems[J]. IEEE Transactions on Components and Packaging Technologies, 2008, 31(4): 801-815.
5	Fan Y, Winkel C, Kulkarni D, et al. Analytical design methodology for liquid based cooling solution for high TDP CPUs[C]//2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). San Diego, CA, USA:IEEE, 2018: 582-586.
6	Sun Y F, Agostini N B, Dong S, et al. Summarizing CPU and GPU design trends with product data[EB/OL]. 2019, arXiv: .
7	Tuckerman D B, Pease R F W. High-performance heat sinking for VLSI[J]. IEEE Electron Device Letters, 1981, 2(5): 126-129.
8	Brunschwiler T, Michel B, Rothuizen H, et al. Interlayer cooling potential in vertically integrated packages[J]. Microsystem Technologies, 2009, 15(1): 57-74.
9	Harpole G M, Eninger J E. Micro-channel heat exchanger optimization[C]//1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium. Phoenix, AZ, USA: IEEE, 2002: 59-63.
10	Zhang X, JI Z, Wang J, et al. Research progress on structural optimization design of microchannel heat sinks applied to electronic devices[J]. Applied Thermal Engineering, 2023, 235: 121294.
11	Sarkas S, Gupta R, Roy T, et al. Review of jet impingement cooling of electronic devices: emerging role of surface engineering[J]. International Journal of Heat and Mass Transfer, 2023, 206: 123888.
12	杨宇驰, 吕佩珏, 杜建宇, 等. 大面积处理芯片嵌入式微流体冷却技术[J]. 微电子学与计算机, 2023, 40(1): 105-123.
	Yang Y C, Lyu P J, Du J Y, et al. Embedded microfluidic cooling technology for large-area processing chips[J]. Microelectronics & Computer, 2023, 40(1): 105-123.
13	Brunschwiler T, Rothuizen H, Fabbri M, et al. Direct liquid jet-impingment cooling with micron-sized nozzle array and distributed return architecture[C]// Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. IEEE, 2006: 196-203.
14	Luo Y, Zhang J Z, Li W. A comparative numerical study on two-phase boiling fluid flow and heat transfer in the microchannel heat sink with different manifold arrangements[J]. International Journal of Heat and Mass Transfer, 2020, 156: 119864.
15	Lin Y H, Luo Y, Li W, et al. Single-phase and two-phase flow and heat transfer in microchannel heat sink with various manifold arrangements[J]. International Journal of Heat and Mass Transfer, 2021, 171:121118.
16	Tong J C K, Sparrow E M, Abraham J P. Geometric strategies for attainment of identical outflows through all of the exit ports of a distribution manifold in a manifold system[J]. Applied Thermal Engineering, 2009, 29(17): 3552-3560.
17	Sharma C S, Schlottig G, Brunschwiler T, et al. A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: an experimental study[J]. International Journal of Heat and Mass Transfer, 2015, 88: 684-694.
18	Zhang J, An J, Xin G, et al. Thermal and hydrodynamic characteristics of single-phase flow in manifold microchannels with countercurrent regions[J]. International Journal of Heat and Mass Transfer, 2023, 211: 124265.
19	Chen C, Wang X, Yuan B, et al. Investigation of flow and heat transfer performance of the manifold microchannel with different manifold arrangements[J]. Case Studies in Thermal Engineering, 2022, 34: 102073.
20	Tang W Y, Li J Y, Wu Z, et al. A numerical investigation of the thermal-hydraulic performance during subcooled flow boiling in MMCs with different manifolds[J]. Applied Thermal Engineering, 2024, 236: 121820.
21	Yang M, Cao B Y. Numerical study on flow and heat transfer of a hybrid microchannel cooling scheme using manifold arrangement and secondary channels[J]. Applied Thermal Engineering, 2019, 159: 113896.
22	Pan Y H, Zhao R, Fan X H, et al. Study on the effect of varying channel aspect ratio on heat transfer performance of manifold microchannel heat sink[J]. International Journal of Heat and Mass Transfer, 2020, 163(1):120461-120461.
23	Chen C W, Li F, Wang X Y, et al. Improvement of flow and heat transfer performance of manifold microchannel with porous fins[J]. Applied Thermal Engineering, 2022, 206: 118129.
24	Yuan Y, Chen L, Zhang C D, et al. Numerical investigation of flow boiling heat transfer in manifold microchannels[J]. Applied Thermal Engineering, 2022, 217: 119268.
25	Chen H R, Han Y, Tang G Y. Numerical investigation of the optimization on manifold microchannel heat sink towards the water-cooling limit[C]//2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). Singapore:IEEE, 2021: 513-518.
26	Pan Y H, Zhao R, Nian Y L, et al. Numerical study on heat transfer characteristics of a pin-fin staggered manifold microchannel heat sink[J]. Applied Thermal Engineering, 2023, 219: 119436.
27	Han Y, Lau B L, Tang G, la et. Si-based hybrid microcooler with multiple drainage microtrenches for high heat flux cooling[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(1): 50-57.
28	Hazra S, Wei T W, Lin Y, et al. Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling[J]. International Journal of Heat and Mass Transfer, 2022, 197: 123356.
29	Gilmore N, Hassanzadeh-Barforoushi A, Timchenko V, et al. Manifold configurations for uniform flow via topology optimisation and flow visualisation[J]. Applied Thermal Engineering, 2021, 183: 116227.
30	Tang W, Sun L, Liu H, et al. Improvement of flow distribution and heat transfer performance of a self-similarity heat sink with a modification to its structure[J]. Applied Thermal Engineering, 2017, 121: 163-171.
31	Piazza A, Hazra S, Jung K W, et al. Considerations and challenges for large area embedded micro-channels with 3D manifold in high heat flux power electronics applications[C]//2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA. IEEE, 2020: 77-82.

编辑推荐 0

Metrics

阅读次数

全文

483

HTML			PDF

最新录用	在线预览	正式出版	最新录用	在线预览	正式出版
1	0	26	38	0	418

来源	本网站	其他网站

次数	185	298
比例	38%	62%

摘要

505

最新录用	在线预览	正式出版

109	0	396

来源	本网站	其他网站

次数	63	442
比例	12%	88%

[1]	李静, 张方芳, 王帅帅, 徐建华, 张朋远. 凹腔结构对正丁烷部分预混火焰可燃极限的影响[J]. 化工学报, 2024, 75(5): 2081-2090.
[2]	谢磊, 徐永生, 林梅. 不同截面肋柱-软尾结构单相流动传热比较[J]. 化工学报, 2024, 75(5): 1787-1801.
[3]	关朝阳, 黄国庆, 张一喃, 陈宏霞, 杜小泽. 泡沫铜导离气泡强化流动沸腾换热实验研究[J]. 化工学报, 2024, 75(5): 1765-1776.
[4]	王文雅, 张玮, 楼小玲, 钟若菲, 陈冰冰, 贠军贤. 纳米纤维素嵌合型晶胶微球的多微管成形与模拟[J]. 化工学报, 2024, 75(5): 2060-2071.
[5]	王金山, 王世学, 朱禹. 冷却表面温差对高温质子交换膜燃料电池性能的影响[J]. 化工学报, 2024, 75(5): 2026-2035.
[6]	师毓辉, 邢继远, 姜雪晗, 叶爽, 黄伟光. 基于PBM的离心式叶轮内气泡破碎合并数值模拟[J]. 化工学报, 2024, 75(5): 1816-1829.
[7]	李怡菲, 董新宇, 王为术, 刘璐, 赵一璠. 微肋板表面干冰升华喷雾冷却传热数值模拟[J]. 化工学报, 2024, 75(5): 1830-1842.
[8]	李娟, 曹耀文, 朱章钰, 石雷, 李佳. 仿生正形尾鳍结构微通道流动与传热特性数值研究及结构优化[J]. 化工学报, 2024, 75(5): 1802-1815.
[9]	吉笑盈, 郑园, 李晓鹏, 杨振, 张维, 邱诗蕊, 张倩颖, 罗沧海, 孙东鹏, 陈东, 李东亮. 微流控可控制备液滴、颗粒和胶囊及其应用[J]. 化工学报, 2024, 75(4): 1455-1468.
[10]	赵金鹏, 张永民, 兰斌, 罗节文, 赵碧丹, 王军武. 气固鼓泡床结构双流体传热模型及其模拟验证[J]. 化工学报, 2024, 75(4): 1497-1507.
[11]	成文凯, 颜金钰, 王嘉骏, 冯连芳. 卧式捏合反应器及其在聚合工业中的研究进展[J]. 化工学报, 2024, 75(3): 768-781.
[12]	谭耀文, 姜攀星, 杜青, 余婉秋, 温小飞, 詹志刚. 工作电压对PEMFC膜电极衰退影响模拟研究[J]. 化工学报, 2024, 75(3): 974-986.
[13]	谷世良, 谭博仁, 程全中, 姚玮洁, 董志鹏, 许峰, 王勇. 轴流泵式混合室内水力学特征的数值模拟[J]. 化工学报, 2024, 75(3): 815-822.
[14]	陈彦松, 阮达, 刘渊博, 郑通, 张帅帅, 马学虎. 微通道换热器拓扑结构优化与性能研究[J]. 化工学报, 2024, 75(3): 823-835.
[15]	徐百平, 梁瑞凤, 喻慧文, 吴桂群, 肖书平. 双螺杆挤出机强化三角形转子作用下的腔内分布混合模拟[J]. 化工学报, 2024, 75(3): 858-866.