喷雾冷却技术及其强化传热机制研究进展

doi:10.11949/0438-1157.20241060

摘要/Abstract

摘要：

喷雾冷却因具有散热能力强、工质用量少、接触热阻低等优点，已成为解决大功率电子元器件散热问题的有效途径。通过梳理喷雾冷却的换热机理及主要强化传热手段，指出了喷雾冷却技术目前所面临的挑战和瓶颈，以及未来的主要发展方向。首先，回顾了喷雾冷却过程中热量传递的基本形式，通过与其他散热方式进行对比，发现复杂的换热机理使得喷雾冷却在实现高热通量散热方面极具发展潜力。其次，详细介绍了喷雾冷却各类强化手段实验研究的最新进展，包括工质改性、表面处理、喷雾参数优化以及施加外部物理场等。随后，着重介绍了基于外加电场的新型静电喷雾冷却技术的最新研究进展情况。最后，对喷雾冷却技术后续在理论研究和工业应用中的机遇和挑战进行了探讨。

关键词: 喷雾冷却, 换热机理, 强化传热, 静电喷雾, 热管理

Abstract:

Spray cooling has become an effective way to solve the heat dissipation problem of high-power electronic components due to its advantages of strong heat dissipation capacity, low working fluid consumption, and low contact thermal resistance. By summarizing the heat transfer enhancement mechanism of spray cooling, the challenges and bottlenecks currently faced by spray cooling technology, as well as the main development direction in the future, are pointed out. Firstly, the heat transfer mechanism of spray cooling is summarized. Compared with other cooling technologies, spray cooling with complicated heat transfer mechanism is more conducive to the heat dissipation of high-power electronic devices. Secondly, the latest experimental research progress of various strengthening means of spray cooling is introduced in detail, focusing on the working medium modification, surface treatment, spray parameters optimization and external physical field application. Then, the research status of novel electrospray cooling with a high-voltage electric field is introduced. Finally, the scientific challenges and technical bottlenecks of spray cooling technology in theoretical research and industrial application as well as the future direction of efforts are discussed.

Key words: spray cooling, heat transfer mechanism, heat transfer enhancement, electrospray, thermal management

中图分类号:

TK 124

孙睿, 王军锋, 许浩洁, 李步发, 徐雅弦. 喷雾冷却技术及其强化传热机制研究进展[J]. 化工学报, 2025, 76(4): 1404-1421.

Rui SUN, Junfeng WANG, Haojie XU, Bufa LI, Yaxian XU. Research progress on heat transfer enhancement mechanism of spray cooling technology[J]. CIESC Journal, 2025, 76(4): 1404-1421.

图/表 12

图1 不同冷却方式散热能力对比

Fig.1 Comparison of heat dissipation capacity of different cooling types

图2 喷雾冷却换热机理示意图[34]

Fig.2 Schematic diagram of spray cooling heat transfer mechanism [34]

图3 典型喷雾冷却曲线(FC-72, 93 ml/min, 0.1 MPa)[31]

Fig.3 Typical spray cooling curve (FC-72, 93 ml/min, 0.1 MPa)[31]

图4 与单一纳米流体体积分数相同的混合纳米流体中协同热效应：分散状态(a)；TiO2/EG-W纳米流体的透射电镜照片(b)；团簇内部结构(c)；Al2O3-TiO2/EG-W纳米流体的透射电镜照片及颗粒粒径分布(d)[54]

Fig.4 Demonstration of the synergistic thermal effect in hybrid nanofluids for the same volume fraction as mono nanofluids dispersed status (a), TEM image of TiO2/EG-W nanofluid (b), inner structure of the cluster (c), and TEM images and particles size percent of Al2O3-TiO2/EG-W nanofluid (d)[54]

图5 应用于喷雾冷却系统的微结构表面的扫描电镜照片

Fig.5 SEM images of micro-structured surfaces applied in the spray cooling system

图6 喷淋倾角对喷雾冷却影响的原理[99]

Fig.6 Schematic diagram of the influence of spray angle on spray cooling[99]

图7 (a)喷淋板设计及MCM上加热元件的布局[102]；(b)用于传热数据的喷淋板及带有测试模具的多芯片模块示意图[103]；(c)喷嘴阵列[104]

Fig.7 (a) Spray plate design and layout of heater elements on MCM[102]; (b) Spray plate used for heat transfer data and diagram of multichip module (MCM) with test dies[103]; (c) The nozzle array[104]

图8 T = 95℃, We = 61时不同表面的液滴撞击演化图像：(a)铁磁流体(Re = 1968);(b)纯水(Re = 4333)和水表面活性剂溶液(Re = 2277)[110]

Fig.8 Droplet impingement evolution images for different surfaces at T = 95℃ and We = 61: (a) ferrofluid (Re = 1968); (b) pure water (Re = 4333) and water surfactant solution (Re = 2277)[110]

图9 冷空气射流耦合闪蒸过程示意图

Fig.9 Schematic diagram of cold air jet coupled flash evaporation process

图10 真空喷雾闪蒸冷却液滴行为模型[75]及雾化形态[117]

Fig.10 Droplets behavior model of the VSFEC[75]and atomization morphology[117]

图11 (a)常规与荷电条件下静态液滴的形成机制示意图；(b)几种典型的静电喷雾模式[130]

Fig.11 (a) Schematic of the droplet formation mechanisms of neutral and charged liquid; (b) Several representative electrospray modes[130]

图12 典型的静电喷雾冷却装置结构及雾化形态[125-127]

Fig.12 Typical setup and spray morphology of electrospray cooling[125-127]

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