Abstract:

The development of integrated circuits has reduced the size of chips while dramatically increasing their power consumption. The heat dissipation problem of electronic devices caused ty this has become an important bottleneck restricting their rapid development. Microchannel cooling is now considered as the most promising technology to realize ultra-high heat flux dissipation. In this study, a variety of silicon-based micro ribs channel heat sinks with different rib structures are designed and prepared, and their flow and heat transfer characteristics with different hot spots are experimentally investigated and analyzed. The results show that the flow resistance of the staggered rib microchannel is lower, and its pressure drop is 22.8% lower than that of the square rib microchannel under the same Reynolds number condition. Comprehensive comparison, the staggered ribs can effectively destroy the development of the near-wall boundary layer of the fluid with lower flow loss, so that the heat sink can realize efficient cooling of higher heat flux with lower pumping power, and its COP can be increased by up to 14.1% compared with that of the square ribs microchannel. And the change of hot spot position has little effect on the maximum temperature of heat sink.

Key words: electronics cooling, microchannels, flow, heat transfer

摘要：

集成电路的发展使芯片尺寸缩小但设备功耗急剧增加，由此引发的电子设备散热问题已成为限制其快速发展的重要瓶颈。微通道冷却目前被认为是实现超高热通量散热最具前景的技术。设计并制备了具有不同肋片结构的多种硅基微肋通道热沉，对其在局部热点下的流动传热特性进行实验研究和对比分析。结果表明交错肋微通道的流动阻力较低，在相同Reynolds数条件下，其压降比方肋微通道降低22.8%。综合对比，交错肋可以在更低的流动损失条件下有效破坏流体的近壁面边界层的发展，从而使热沉以较低的泵功实现对更高热通量的高效冷却，相比于方肋微通道其COP最高可提升14.1%。而热点不同位置变化对热沉最高温度影响不大。

关键词: 电子设备冷却, 微通道, 流动, 传热