LED平板热管散热系统的性能分析

doi:10.11949/j.issn.0438-1157.20170562

化工学报 ›› 2017, Vol. 68 ›› Issue (S1): 155-161.DOI: 10.11949/j.issn.0438-1157.20170562

LED平板热管散热系统的性能分析

田中轩¹, 王长宏¹, 郑焕培¹, 黄炯桐²

1. 广东工业大学材料与能源学院, 广东广州 510006;
2. 广州宇阳电力科技有限公司, 广东广州 510600

收稿日期:2017-05-05 修回日期:2017-05-09 出版日期:2017-08-31 发布日期:2017-08-31
通讯作者: 王长宏,windyploy@163.com
基金资助:
国家自然科学基金项目（51676049）；广州市科技计划项目（201508030033）。

Heat transfer characteristic of flat plate heat pipe cooling system for LED

TIAN Zhongxuan¹, WANG Changhong¹, ZHEN Huanpei¹, HUANG Jiongtong²

1. School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, Guangdong, China;
2. Guangzhou Yuyang Electric Power Technology Limited Company, Guangzhou 510600, Guangdong, China

Received:2017-05-05 Revised:2017-05-09 Online:2017-08-31 Published:2017-08-31
Supported by:
supported by the National Natural Science Foundation of China (51676049) and the Guangzhou Science and Technology Program (201508030033).

摘要/Abstract

摘要：

设计了一种平板热管，使用氧化-脱水法和分子自组装法分别对铜基底进行亲水、疏水薄膜的制备，通过测量接触角直观地表征其亲水、疏水性能，亲水薄膜的接触角仅为9.3°，疏水薄膜的接触角达到了153°。基于表面改性后的平板热管的特点设计了4种LED散热系统进行对比实验测试，并采用热线型法和热阻分析法对比分析各散热系统的性能。在4种散热系统中，极限散热功率最大的为平板热管-强制对流复合散热系统，其极限散热功率为55 W。

关键词: 平板热管, 传热, 亲疏水薄膜, 实验验证, 优化设计

Abstract:

A new kind of flat plate heat pipe is designed in this article,which uses oxidative dehydration as well as molecular self-assembling method to make hydrophilic and hydrophobic membranes. Membrane's hydrophilicity can be characterized by measuring the contact angle. For hydrophilic membrane,its contact angle is only 9.3°,but that for hydrophobic membrane reaches 153°. Based on the characteristics of the heat pipe after surface modification,four kinds of LED cooling systems are designed for comparison. hot wire method and thermal resistance analysis are used to compare each system's performance. Among theses four cooling systems,the flat plate heat pipe combining with forced convection system has the highest ultimate cooling power,which reaches 55 W.

Key words: flat plate heat pipe, heat transfer, hydrophibic and hydrophobic film, experimental validation, optimal design

中图分类号:

TK124

田中轩, 王长宏, 郑焕培, 黄炯桐. LED平板热管散热系统的性能分析[J]. 化工学报, 2017, 68(S1): 155-161.

TIAN Zhongxuan, WANG Changhong, ZHEN Huanpei, HUANG Jiongtong. Heat transfer characteristic of flat plate heat pipe cooling system for LED[J]. CIESC Journal, 2017, 68(S1): 155-161.

参考文献 30

[1]	黄磊,陈洪林.LED照明散热研究进展[J].广州化工,2012,40(8):26-30. HUANG L,CHEN H L. New development of research on heat dissipation of LEDs lighting[J]. Guangzhou Chemical Industry,2012,40(8):26-30.
[2]	朱永明,郑怀,罗小兵.双层基板LED车灯模块及散热性能研究[J].工程热物理学报,2016,37(2):390-393. ZHU Y M,ZHENG H,LUO X B. Thermal performance study of a novel automotive headlamps LED module with double substrates[J]. Journal of Engineering Thermophysics,2016,37(2):390-393.
[3]	CHRISTENSEN A,GARHAM S. Thermal effects in packing high power light emitting diode arrays[J]. Applied Thermal Engineering,2009,29(2):364-371.
[4]	刘霞霞,樊宏,尹荔松.近几年LED照明产业发展综述[J].科技创新导报,2011,(16):124. LIU X X,FAN H,YIN L S. Review on the development of LED lighting industry in recent years[J]. Science and Technology Innovation Herald,2011,(16):124
[5]	ALVIN C,CHU W,CHENG C H,et al. Thermal analysis of extruded aluminum fin heat sink for LED cooling application[C]//Microsystems,Packaging,Assembly and Circuits Technology Conference(IMPACT), 20116th International. IEEE Xplore,2011:397-400.
[6]	QU J,WU H,CHENG P,et al. Recent advances in MEMS-based micro heat pipes[J]. International Journal of Heat & Mass Transfer,2017,110:294-313.
[7]	晏建宇,王双喜,刘高山,等.大功率LED散热技术研究进展[J].照明工程学报,2013,24(5):84-89. YAN J Y,WANG S X,LIU G S,et al. Development of cooling technology for high-power light emitting diode[J]. Illuminating Engineering Journal,2013,24(5):84-89.
[8]	沈喜源.笔记本电脑散热器翅片及结构设计优化[D].上海:上海交通大学,2014. SHEN X Y.Note book computer thermal module fin and structural parts optimization design[D]. Shanghai:Shanghai Jiaotong University,2014.
[9]	LINDSTEDT M,LAMPIO K T,KARVINEN R. Optimum shapes of straight fins and finned heat sinks[J]. Journal of Heat Transfer,2014,137(6):061006.
[10]	MAFEED M P,SALMAN A M,PRABIN C,et al. Optimum length for pin fins used in electronic cooling[J]. Applied Mechanics & Materials,2011,110-116:1667-1673.
[11]	MA H K,CHEN B R,LAN H W,et al. Study of an LED device with a honeycomb heat sink[C]//Semiconductor Thermal Measurement and Management Symposium,2010. Semi-Therm. IEEE Xplore,2010:289-298.
[12]	KHAN W A,CULHAM J R,YOVANOVICH M M. Optimization of pin-fin heat sinks using entropy generation minimization[J]. IEEE Transactions on Components & Packaging Technologies,2007,28(2):247-254.
[13]	唐金沙.CPU风冷散热器的实验研究及流场和温度场的数值模拟[D].湘潭:湘潭大学,2009. TANG J S. Experimental testing of CPU air cooling radiator and numerical simulation of its flow field and temperature field[D]. Xiangtan:Xiangtan University,2009.
[14]	ACIKALIN T,GARIMELLA S V,PETROSKI J,et al. Optimal design of miniature piezoelectric fans for cooling light emitting diodes[C]//Ninth Intersociety Conference on Thermal and Thermo Mechanical phenomena in Electronic Syster. New York,2004:663-671.
[15]	COTTER T P. Principles and prospects for micro heat pipes[J]. NASA STI/Recon Technical Report N,1984:84.
[16]	RANJAN R,PATEL A,GARIMELLA S V,et al. Wicking and thermal characteristics of micropillared structures for use in passive heat spreaders[J]. International Journal of Heat & Mass Transfer,2011,55(4):586-596.
[17]	JI X,XU J,ABANDA A M. Copper foam based vapor chamber for high heat flux dissipation[J]. Experimental Thermal & Fluid Science,2012,40(7):93-102.
[18]	何嘉斌.复合吸液芯超薄微热管制造工艺及传热性能分析[D].广州:华南理工大学,2015. HE J B. Fabrication process and thermal performance analysis of ultra-thin flattened micro heat pipe sintered with composited wick structure[D]. Guangzhou:South China University of Technology,2015.
[19]	韩天.基于纤维吸液芯结构平板微热管的研究[D].哈尔滨:哈尔滨工业大学,2012. HAN T. Research on a flat micro heat pipe with fiber wick[D]. Harbin:Harbin Institute of Technology,2012.
[20]	彭毅.基于植物叶片结构的仿生均热板研究[D].广州:华南理工大学,2015. PENG Y.Study of bionic vapor chamber based on the plant leaf structure[D]. Guangzhou:South China University of Technology,2015.
[21]	PENG Y,LIU W,LIU B,et al. The performance of the novel vapor chamber based on the leaf vein system[J]. International Journal of Heat & Mass Transfer,2015,86:656-666.
[22]	KANG S W,TSAI S H,CHEN H C. Fabrication and test of radial grooved micro heat pipes[J]. Applied Thermal Engineering,2002,22(14):1559-1568.
[23]	AVENAS Y,GILLOT C,BRICARD A,et al. On the use of flat heat pipes as thermal spreaders in power electronics cooling[C]//Power Electronics Specialists Conference,2002. Pesc 02. 2002 IEEE. IEEE Xplore,2002,2:753-757.
[24]	AVENAS Y,IVANOVA M,POPOVA N,et al. Thermal analysis of thermal spreaders used in power electronics cooling[C]//Industry Applications Conference,2002. Ias Meeting. Conference Record of the. IEEE,2002,1:216-221
[25]	CHIEN H T,LEE D S,DING P P,et al. Disk-shaped miniature heat pipe (dmhp) with radiating micro grooves for a to can laser diode package[J]. IEEE Transactions on Components And Packaging Technologies,2003,26(3):569-574.
[26]	CHIEN H T,TSAI C I,CHEN P H,et al. Improvement on thermal performance of a disk-shaped miniature heat pipe with nanofluid[C]//International Conference on Electronic Packaging Technology Proceedings. IEEE Xplore,2003:389-391.
[27]	LAI A,GILLOT C,IVANOVA M,et al. Thermal characterization of flat silicon heat pipes[C]//Proceedings of the 20 th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.New York,USA:IEEE,2004:21-25.
[28]	陈金建,汪双凤.平板热管散热技术研究进展[J].化工进展,2009,28(12):2105-2108. CHEN J J,WANG S F. Research progress in flat plate heat pipes[J]. Chemical Industry and Engineering Progress,2009,28(12):2105-2108.
[29]	赵亮,田沣,杨龙. 均热板散热性能实验研究[J].机械工程师,2016,(2):23-25. ZHAO L,TIAN F,YANG L. Experimental research on heat dissipation performance of vapor chamber[J]. Mechanical Engineer,2016,(2):23-25.
[30]	王忠锋,黄伟玲,白金强.大功率LED灯具散热的优化设计[J]. 照明工程学报,2014,25(3):84-88. WANG Z F,HUANG W L,BAI J Q. Heat dissipation optimal design for high power LED luminaire[J]. China Illuminating Engineering Journal,2014,25(3):84-88.

LED平板热管散热系统的性能分析

Heat transfer characteristic of flat plate heat pipe cooling system for LED

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