ChCl-urea-ZnO-Cu2O低共熔溶剂电镀铜锌合金

doi:10.11949/j.issn.0438-1157.20180649

化工学报 ›› 2018, Vol. 69 ›› Issue (10): 4402-4408.DOI: 10.11949/j.issn.0438-1157.20180649

ChCl-urea-ZnO-Cu₂O低共熔溶剂电镀铜锌合金

刘海, 徐存英, 唐杰, 朱啸林, 王祥, 黄梦婷, 华一新, 张启波

昆明理工大学冶金与能源工程学院, 云南昆明 650093

收稿日期:2018-06-13 修回日期:2018-07-30 出版日期:2018-10-05 发布日期:2018-10-05
通讯作者: 徐存英
基金资助:
国家自然科学基金项目（21263007）；国家重点基础研发展计划项目（2014CB643404）。

Electroplating of Zn-Cu alloys in ChCl-urea-ZnO-Cu₂O deep eutectic solvents

LIU Hai, XU Cunying, TANG Jie, ZHU Xiaolin, WANG Xiang, HUANG Mengting, HUA Yixin, ZHANG Qibo

College of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming 650093, Yunnan, China

Received:2018-06-13 Revised:2018-07-30 Online:2018-10-05 Published:2018-10-05
Supported by:
supported by the National Natural Science Foundation of China (21263007) and the National Basic Research Program of China (2014CB643404).

摘要/Abstract

摘要：

以ChCl-urea-ZnO-Cu₂O低共熔溶剂为电解质在343 K镍基体上电沉积制备得到了铜锌合金镀层。伏安曲线测试表明在沉积过程中，镍基体能够诱导金属Zn发生欠电位沉积，从而实现了Cu-Zn合金的共沉积。同时研究了沉积电势对镀层成分和形貌的影响，结果表明：沉积电势由-0.85 V （vs Ag）增加到-1.3 V （vs Ag）时，合金镀层中Zn原子百分数从0升高到76.29%。在沉积电势为-1.10～-1.15 V范围内，Zn原子百分数为12.5%～20.81%时，镀层平整致密，颜色为金色，达到仿金镀的效果。

关键词: 铜锌合金, 低共熔溶剂, 共沉积, 仿金镀, 膜, 沉积物, 电化学

Abstract:

Cu-Zn alloy was electrodeposited on nickel substrate in ChCl-urea-ZnO-Cu₂O deep eutectic solvents at 343 K. The voltammetric curve test shows that cluring the deposition process, the nickel matrix can induce the underpotential deposition of the metallic Zn, thus achieving the co-deposition of the Cu-Zn alloy. The effects of deposition potential on composition, surface and morphology of Cu-Zn alloy coatings were also studied. The results indicate that when deposition potential negatively shifts from -0.85 V(vs Ag) to -1.30 V (vs Ag), the Zn content in the alloy increases from 0 to 76.29%(atom). When deposition potential is located in the range of -1.10——1.15 V, the content of Zn is in the range of 12.5%(atom)-20.81%(atom), the alloy coating is golden. Thus, the imitating Gold plating can be achieved in ChCl-urea-ZnO-Cu₂O deep eutectic solvents by controlling a suitable deposition potential.

Key words: Cu-Zn alloys, deep eutectic solvent, co-deposition, imitating gold plating, membranes, deposition, electrochemistry

中图分类号:

TB383

刘海, 徐存英, 唐杰, 朱啸林, 王祥, 黄梦婷, 华一新, 张启波. ChCl-urea-ZnO-Cu₂O低共熔溶剂电镀铜锌合金[J]. 化工学报, 2018, 69(10): 4402-4408.

LIU Hai, XU Cunying, TANG Jie, ZHU Xiaolin, WANG Xiang, HUANG Mengting, HUA Yixin, ZHANG Qibo. Electroplating of Zn-Cu alloys in ChCl-urea-ZnO-Cu₂O deep eutectic solvents[J]. CIESC Journal, 2018, 69(10): 4402-4408.

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ChCl-urea-ZnO-Cu₂O低共熔溶剂电镀铜锌合金

Electroplating of Zn-Cu alloys in ChCl-urea-ZnO-Cu₂O deep eutectic solvents

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