基于相变微胶囊悬浮液的芯片阵列冷却特性研究

doi:10.11949/0438-1157.20240176

摘要/Abstract

摘要：

针对传统离散相模型（DPM）由于未考虑颗粒体积影响导致无法准确预测相变微胶囊悬浮液（MEPCMS）的压降，采用修正DPM模型，准确预测MEPCMS在芯片阵列中的流动传热特性，考察芯片发热功率及功率分布对冷却特性的影响规律。结果表明，MEPCMS相比于纯基液，平均Nusselt数Nu_av最高可提升30.03%，壁面温升ΔT_w最高可降低7.19%，综合性能评价因子η均大于1；芯片功率越高越靠近出口，悬浮液冷却效果提升越明显，高功率芯片靠近进口有利于抑制芯片的最高温升，靠近出口时悬浮液Nu_av的增幅大于摩擦因子和进出口压降的增幅，可见其受发热功率的影响较小，受功率分布的影响较大。为MEPCMS在细小通道内流动传热特性的认识及在电子器件热管理方面的应用提供参考。

关键词: 相变微胶囊悬浮液, 微通道, 芯片阵列热管理, 颗粒流, 数值模拟

Abstract:

In view of the fact that the traditional discrete phase model (DPM) cannot accurately predict the pressure drop of microencapsulated phase change material slurry (MEPCMS) because it does not consider the effect of particle volume, the modified DPM is used to accurately predict the flow heat transfer characteristics of MEPCMS in the chip array, and the influence of chip heating power and power distribution on cooling characteristics is investigated. The results show that compared to pure base liquid cooling, the suspension can increase the average Nusselt number Nu_avof MEPCMS by up to 30.03%, resulting in a maximum decrease of ΔT_w by 7.19%. The comprehensive performance evaluation factors of the suspension are all greater than 1. The closer the high-power chip is to the inlet, the more favorable it is to suppress the highest temperature rise of the chip. When a high-power chip approaches the outlet, the Nu_av increase of the suspension is greater than the increase in friction factor and inlet/outlet pressure drop. Therefore, it is obvious that it is less affected by the chip heating power and more affected by the chip power distribution. This work helps to understand the heat transfer characteristics and influence laws of MEPCMS in chip thermal management.

Key words: microencapsulated phase change material slurry, microchannels, chip thermal management, particle flow, numerical simulation

中图分类号:

O 359

方立昌, 李梓龙, 陈博, 苏政, 贾莉斯, 王智彬, 陈颖. 基于相变微胶囊悬浮液的芯片阵列冷却特性研究[J]. 化工学报, 2024, 75(7): 2455-2464.

Lichang FANG, Zilong LI, Bo CHEN, Zheng SU, Lisi JIA, Zhibin WANG, Ying CHEN. Study on cooling characteristics of chip array based on microencapsulated phase change material slurry[J]. CIESC Journal, 2024, 75(7): 2455-2464.

图/表 10

图1 芯片阵列冷却的示意图

Fig.1 Schematic of the chip array cooling

表1 材料物性参数

Table 1 Physical property parameters of materials

材料	ρ/(kg·m^-3)	c_p /(J·kg^-1·K^-1)	k/(W·m^-1·K^-1)	μ/(Pa·s)
正二十烷（固态/液态）	815.0/780.0	1920.0/2460.0	0.150	—
PMMA（壳层）	1180.0	1440.0	0.184	—
MEPCM	849.8	2047.5	0.140	—
water	ρ_f	c_p,_f	k_f	μ_f

表2 网格无关性验证

Table 2 Grid sensitivity analysis using MEPCMS

网格数/个	出口流体温差/K	温差误差百分比/%	压降/Pa	压降误差百分比/%
358400	28.14060	0.22	133.36781	3.66
448000	28.13032	0.19	133.98217	3.22
716800	28.12691	0.18	135.17545	2.36
896000	28.11733	0.14	137.15393	0.93
1792000	28.07688	—	138.43996	—

图2 模型验证

Fig.2 Model validation

图3 不同芯片总功率下各个芯片的最高温度

Fig.3 The highest temperature of each chip under different total chip power

图4 不同芯片总功率下各个芯片的最大温差

Fig.4 The maximum temperature difference of each chip under different total chip power

图5 不同总功率下的流动传热性能评价

Fig.5 Evaluation of flow and heat transfer performance under different total chip power

表3 芯片功率非均匀分布工况

Table 3 Chip power non-uniform distribution condition

工况编号	高功率芯片	低功率芯片
Ⅰ	chip 1~chip 4	chip 5~chip 8
Ⅱ	chip 2~chip 5	chip 1、chip 6~chip 8
Ⅲ	chip 3~chip 6	chip 1~chip 2、chip 7~chip 8
Ⅳ	chip 4~chip 7	chip 1~chip 3、chip 8
Ⅴ	chip 5~chip 8	chip 1~chip 4

图6 芯片功率非均匀分布下各个芯片的最高温度和最大温差

Fig.6 The highest temperature and maximum temperature difference of each chip under non-uniform chip power distribution

图7 芯片功率非均匀分布下流动传热性能评价

Fig.7 Evaluation of flow and heat transfer performance under non-uniform chip power distribution

参考文献 43

1	Zhou W N, Dong K J, Sun Q, et al. Research progress of the liquid cold plate cooling technology for server electronic chips: a review[J]. International Journal of Energy Research, 2022, 46(9): 11574-11595.
2	Tang H, Tang Y, Wan Z P, et al. Review of applications and developments of ultra-thin micro heat pipes for electronic cooling[J]. Applied Energy, 2018, 223: 383-400.
3	Vasileska D. Modeling thermal effects in nano-devices[J]. Microelectronic Engineering, 2013, 109: 163-167.
4	Ansari D, Kim K Y. Hotspot thermal management using a microchannel-pinfin hybrid heat sink[J]. International Journal of Thermal Sciences, 2018, 134: 27-39.
5	Maganti L S, Dhar P, Sundararajan T, et al. Mitigating non-uniform heat generation induced hot spot(s) in multicore processors using nanofluids in parallel microchannels[J]. International Journal of Thermal Sciences, 2018, 125: 185-196.
6	Hao X H, Peng B, Xie G N, et al. Efficient on-chip hotspot removal combined solution of thermoelectric cooler and mini-channel heat sink[J]. Applied Thermal Engineering, 2016, 100: 170-178.
7	Mahajan R, Chiu C, Chrysler G. Cooling a microprocessor chip[J]. Proceedings of the IEEE, 2006, 94: 1476-1486.
8	Tuckerman D B, Pease R F W. High-performance heat sinking for VLSI[J]. IEEE Electron Device Letters, 1981, 2(5): 126-129.
9	Siddique A, Sakalkale K, Saha S K, et al. Investigation of flow distribution and effect of aspect ratio on critical heat flux in multiple parallel microchannel flow boiling[J]. Heat and Mass Transfer, 2021, 57(4): 647-663.
10	聂晓蕾, 余灏成, 朱婉婷, 等. 石墨烯/Bi_0.5Sb_1.5Te₃柔性热电薄膜及其面内散热器件的设计制备与性能评价[J]. 物理学报, 2022, 71(15): 235-244.
	Nie X L, Yu H C, Zhu W T, et al. Design,fabrication and performance evaluation of graphene/Bi_0.5Sb_1.5Te₃ flexible thermoelectric films and in-plane heat dissipation devices[J]. Acta Physica Sinica, 2022, 71(15): 235-244.
11	Fan Y, Zhao X D, Li G Q, et al. Analytical and experimental study of an innovative multiple-throughout-flowing micro-channel-panels-array for a solar-powered rural house space heating system[J]. Energy, 2019, 171: 566-580.
12	Hasan M I. Numerical investigation of counter flow microchannel heat exchanger with MEPCM suspension[J]. Applied Thermal Engineering, 2011, 31(6/7): 1068-1075.
13	Nazir H, Batool M, Bolivar Osorio F J, et al. Recent developments in phase change materials for energy storage applications: a review[J]. International Journal of Heat and Mass Transfer, 2019, 129: 491-523.
14	Wang F X, Lin W Z, Ling Z Y, et al. A comprehensive review on phase change material emulsions: fabrication, characteristics, and heat transfer performance[J]. Solar Energy Materials and Solar Cells, 2019, 191: 218-234.
15	张明焜, 陈硕, 尚智. 带凹槽的微通道中液滴运动数值模拟[J]. 物理学报, 2012, 61(3): 247-259.
	Zhang M K, Chen S, Shang Z. Numerical simulation of a droplet motion in a grooved microchannel[J]. Acta Physica Sinica, 2012, 61(3): 247-259.
16	郭义丰, 王智彬, 贾莉斯, 等. 液冷微通道内相变微胶囊的壁面温升抑制特性数值模拟[J]. 物理学报, 2023, 72(10): 273-284.
	Guo Y F, Wang Z B, Jia L S, et al. Numerical simulation of inhibition characteristics of wall temperature rise of phase change microcapsule in liquid-cooled microchannel[J]. Acta Physica Sinica, 2023, 72(10): 273-284.
17	Song K X, Guo Y F, Wang Z B, et al. Numerical simulation study on heat transfer characteristics of particle-loaded flow in microchannels[J]. Chemical Engineering & Technology, 2024. 47(2): 387-395.
18	Liu L K, Alva G, Jia Y T, et al. Dynamic thermal characteristics analysis of microencapsulated phase change suspensions flowing through rectangular mini-channels for thermal energy storage[J]. Energy and Buildings, 2017, 134: 37-51.
19	Zhang G H, Cui G M, Dou B L, et al. An experimental investigation of forced convection heat transfer with novel microencapsulated phase change material slurries in a circular tube under constant heat flux[J]. Energy Conversion and Management, 2018, 171: 699-709.
20	Chen M, Wang Y, Liu Z M. Experimental study on micro-encapsulated phase change material slurry flowing in straight and wavy microchannels[J]. Applied Thermal Engineering, 2021, 190: 116841.
21	Rajabi Far B, Mohammadian S K, Khanna S K, et al. Effects of pin tip-clearance on the performance of an enhanced microchannel heat sink with oblique fins and phase change material slurry[J]. International Journal of Heat and Mass Transfer, 2015, 83: 136-145.
22	Hu X X, Zhang Y P. Novel insight and numerical analysis of convective heat transfer enhancement with microencapsulated phase change material slurries: laminar flow in a circular tube with constant heat flux[J]. International Journal of Heat and Mass Transfer, 2002, 45(15): 3163-3172.
23	Dai H, Chen W. Numerical investigation of heat transfer in the double-layered minichannel with microencapsulated phase change suspension[J]. International Communications in Heat and Mass Transfer, 2020, 119: 104918.
24	Languri E M, Rokni H B, Alvarado J, et al. Heat transfer analysis of microencapsulated phase change material slurry flow in heated helical coils: a numerical and analytical study[J]. International Journal of Heat and Mass Transfer, 2018, 118: 872-878.
25	Alquaity A B S, Al-Dini S A, Yilbas B S. Investigation into thermal performance of nanosized phase change material (PCM) in microchannel flow[J]. International Journal of Numerical Methods for Heat & Fluid Flow, 2013, 23(2): 233-247.
26	Xia G D, Ma D D, Zhai Y L, et al. Experimental and numerical study of fluid flow and heat transfer characteristics in microchannel heat sink with complex structure[J]. Energy Conversion and Management, 2015, 105: 848-857.
27	Dammel F, Stephan P. Heat transfer to suspensions of microencapsulated phase change material flowing through minichannels[J]. Journal of Heat Transfer, 2012, 134(2): 1.
28	Yang L, Liu S L, Zheng H F. A comprehensive review of hydrodynamic mechanisms and heat transfer characteristics for microencapsulated phase change slurry (MPCS) in circular tube[J]. Renewable and Sustainable Energy Reviews, 2019, 114: 109312.
29	Chai L, Shaukat R, Wang L, et al. A review on heat transfer and hydrodynamic characteristics of nano/microencapsulated phase change slurry (N/MPCS) in mini/microchannel heat sinks[J]. Applied Thermal Engineering, 2018, 135: 334-349.
30	Mahdavi M, Sharifpur M, Meyer J P. CFD modelling of heat transfer and pressure drops for nanofluids through vertical tubes in laminar flow by Lagrangian and Eulerian approaches[J]. International Journal of Heat and Mass Transfer, 2015, 88: 803-813.
31	Maxwell J C A. A treatise on electricity and magnetism[J]. Nature, 1873, 7: 478-480.
32	Batchelor G K. The effect of Brownian motion on the bulk stress in a suspension of spherical particles[J]. Journal of Fluid Mechanics, 1977, 83: 97-117.
33	Shi X J, Li S, Wei Y D, et al. Numerical investigation of laminar convective heat transfer and pressure drop of water-based Al₂O₃ nanofluids in a microchannel[J]. International Communications in Heat and Mass Transfer, 2018, 90: 111-120.
34	Mohammadpour J, Lee A, Mozafari M, et al. Evaluation of Al₂O₃-water nanofluid in a microchannel equipped with a synthetic jet using single-phase and Eulerian-Lagrangian models[J]. International Journal of Thermal Sciences, 2021, 161: 106705.
35	Morsi S A, Alexander A J. An investigation of particle trajectories in two-phase flow systems[J]. Journal of Fluid Mechanics, 1972, 55: 193-208.
36	Ounis H, Ahmadi G, McLaughlin J B. Brownian diffusion of submicrometer particles in the viscous sublayer[J]. Journal of Colloid and Interface Science, 1991, 143(1): 266-277.
37	Mahian O, Kolsi L, Amani M, et al. Recent advances in modeling and simulation of nanofluid flows(part Ⅰ): Fundamentals and theory[J]. Physics Reports, 2019, 790: 1-48.
38	Kumari M, Gorla R S R. Natural convection heat and mass transfer from a sphere in non-Newtonian nanofluids[J]. Proceedings of the Institution of Mechanical Engineers, Part N: Journal of Nanoengineering and Nanosystems, 2014, 228(3): 129-138.
39	McNab G S, Meisen A. Thermophoresis in liquids[J]. Journal of Colloid and Interface Science, 1973, 44(2): 339-346.
40	Li A, Ahmadi G. Dispersion and deposition of spherical particles from point sources in a turbulent channel flow[J]. Aerosol Science Technology, 1992, 16(4): 209-226.
41	Ranz W E, Marshall W R. Evaporation from drops(part Ⅰ)[J]. Chemical Engineering Progress, 1952, 48(3): 141-148.
42	Rao Y, Dammel F, Stephan P, et al. Convective heat transfer characteristics of microencapsulated phase change material suspensions in minichannels[J]. Heat and Mass Transfer, 2007, 44(2): 175-186.
43	Zeng R L, Wang X, Chen B J, et al. Heat transfer characteristics of microencapsulated phase change material slurry in laminar flow under constant heat flux[J]. Applied Energy, 2009, 86(12): 2661-2670.

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