基于杂环结构的耐高温聚酰亚胺材料研究进展

doi:10.11949/0438-1157.20191571

摘要/Abstract

摘要：

聚酰亚胺(PI)作为一种应用广泛的高性能高分子材料，具有独特的结构特征以及优异的综合性能。功能化的PI薄膜可以用于气体分离膜、柔性光电器件基底等多个领域，随着科技的快速发展，对于PI薄膜的各项性能要求越来越高。热性能在许多工艺中起着十分重要的作用，含杂环结构的PI具有很强的刚性，使其具有出众的耐高温性能，但同时也存在着难以溶解等方面的问题。本文综述了近年来含杂环结构的PI在耐高温方面的研究进展，重点介绍了含有嘧啶、吡啶、苯并咪唑等杂环结构的新型单体以及相应的PI的合成，对其热性能、力学性能等表征进行了相关的概述，指出杂环的特殊结构带来的优势以及目前迫切需要改进的地方，并对含杂环结构的耐高温PI的应用发展前景进行了展望。

关键词: 聚酰亚胺, 杂环, 耐高温, 合成, 聚合物, 膜

Abstract:

Polyimide (PI), as a widely used high-performance polymer material has unique structural characteristics and excellent comprehensive properties. The functionalized PI films can be used in many fields, such as gas separation films, flexible optoelectronic device substrates, etc. With the rapid development of science and technology, there are higher requirements for the performance of PI films. Thermal performance plays a very important role in many processes. PI with heterocyclic structure has strong rigidity, which makes it have excellent high temperature resistance, but at the same time there are problems such as difficulty in dissolving. In this paper, the research progress in recent years of PI with heterocyclic structure in high temperature resistance is reviewed. The synthesis of new monomers and corresponding PI, which containing pyrimidine, pyridine, benzimidazole and other heterocyclic structures, is emphasized. The characterization of its thermal and mechanical properties is summarized. The advantages and the problems caused by the special heterocyclic structure are pointed out. In addition, the prospects of the application and the development of high temperature resistant PI with heterocyclic structure are discussed.

Key words: polyimide, heterocyclic, high temperature resistant, synthesis, polymer, membrane

中图分类号:

TQ 31

李彬, 王凯君, 姜爽, 张天永, 闫子然, 王迪, 刘艺炜. 基于杂环结构的耐高温聚酰亚胺材料研究进展[J]. 化工学报, 2020, 71(6): 2643-2659.

Bin LI, Kaijun WANG, Shuang JIANG, Tianyong ZHANG, Ziran YAN, Di WANG, Yiwei LIU. Progress in synthesis of high temperature resistant polyimides with heterocyclic structure[J]. CIESC Journal, 2020, 71(6): 2643-2659.

图/表 8

参考文献 69

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