聚双胍/环氧树脂体系潜伏性固化过程

doi:10.11949/j.issn.0438-1157.20140904

化工学报 ›› 2015, Vol. 66 ›› Issue (1): 464-470.DOI: 10.11949/j.issn.0438-1157.20140904

• 材料化学工程与纳米技术 • 上一篇下一篇

聚双胍/环氧树脂体系潜伏性固化过程

王权, 史铁钧, 张焱, 虞伕, 刘建华

合肥工业大学化工学院, 安徽合肥 230009

收稿日期:2014-06-16 修回日期:2014-10-14 出版日期:2015-01-05 发布日期:2015-01-05
通讯作者: 史铁钧
基金资助:
国家自然科学基金项目(51273054)。

Latent curing of polybiguanide/epoxy resin

WANG Quan, SHI Tiejun, ZHANG Yan, YU Fu, LIU Jianhua

School of Chemical Engineering, Hefei University of Technology, Hefei 230009, Anhui, China

Received:2014-06-16 Revised:2014-10-14 Online:2015-01-05 Published:2015-01-05
Supported by:
supported by the National Natural Science Foundation of China(51273054).

摘要/Abstract

摘要：

用己二胺与双氰胺熔融缩聚, 合成了一种新型潜伏性环氧树脂固化剂, 并研究了其与环氧树脂的固化过程。用FTIR、XPS、¹H NMR分析了固化剂的结构;用DSC分析得到了固化剂与环氧树脂的适宜配比、固化体系的适宜固化温度及固化动力学参数;通过XRD分析了固化物的相结构;通过TG分析了固化物的热稳定性。结果表明, 与双氰胺环氧树脂固化体系相比, 固化温度降低近70℃, 同时潜伏性能良好, 30 d内固化度少于10%, 热稳定性能良好, 热分解温度超过300℃。

关键词: 聚六亚甲基双胍, 改性双氰胺, 环氧树脂, 潜伏性固化剂, 合成, 动力学, 稳定性

Abstract:

A new latent curing agent for epoxy resin was synthesized via melted polycondensation of dicyandiamide (DICY) and hexamethylenediamine. The structure of the curing agent was analyzed with FTIR, XPS, ¹H NMR. The optimum ratio, suitable curing temperature and curing kinetic parameters of this epoxy resin curing system were studied with DSC. The phase structure of the cured epoxy resin was investigated with XRD. The thermostability of the cured epoxy resin was obtained by TG. Comparing with the DICY/EP curing system, curing temperature dropped by nearly 70℃. Latency performance was fine as curing degree was less than 10% within 30 days. Thermostability was nice as thermal decomposition temperature exceeded 300℃.

Key words: polyhexamethylene biguanidine, modified dicyandiamide, epoxy resin, latent curing agent, synthesis, kinetics, stability

中图分类号:

O631

王权, 史铁钧, 张焱, 虞伕, 刘建华. 聚双胍/环氧树脂体系潜伏性固化过程[J]. 化工学报, 2015, 66(1): 464-470.

WANG Quan, SHI Tiejun, ZHANG Yan, YU Fu, LIU Jianhua. Latent curing of polybiguanide/epoxy resin[J]. CIESC Journal, 2015, 66(1): 464-470.

参考文献 23

[1]	Bengu B, Boerio F J. Interaction of epoxy/dicyandiamide adhesives with metal substrates [J]. The Journal of Adhesion, 2006, 82: 1133-1155
[2]	Fedtke M, Domaratius F, Pfitzmann A. Curing of epoxy resins with dicyandiamide [J]. Polymer Bulletin, 1990, 23: 381-388
[3]	Hajime K, Akihiro Ma, Keiko O. New type of phenolic resin: curing reaction of phenol-novolac based benzoxazine with bisoxazolineor epoxy resin using latent curing agent and the properties of the cured resin [J]. Journal of Applied Polymer Science, 2009, 112: 1762-1770
[4]	Mahnam N, Beheshty M H, Barmar M. Modification of dicyandiamide-cured epoxy resin with different molecular weights of polyethylene glycol and its effect on epoxy/glass prepreg characteristics [J]. High Performance Polymers, 2013, 25(6): 705-713
[5]	Shinn G H, Chau K C. The curing behaviors of the epoxy/dicyanamide system modified with epoxidized natural rubber [J]. Thermochimica Acta, 2004, 417: 99-106
[6]	Shinn G H, Chung S W. DSC and FTIR analysis of the curing behaviors of epoxy/DICY/solvent open systems [J]. Thermochimica Acta, 1998, 316: 167-175
[7]	Kasturiarachchi K A, Geoffrey P. Free dicyandiamide in cross linked epoxy resins [J]. Journal of Materials Science Letters, 1984, 3: 283-286
[8]	Chen Lianxi(陈连喜), Zhang Huiling(张惠玲), Wu Yi(吴益), Lei Jiaheng(雷家珩). Syntheses and properties of curing agent modified dicyandiamide by p-toluidine [J]. Zhanjie(粘接), 2004, 25(4):17-19
[9]	Poisson N, Maazouz A, Sautereau H, Taha M, Gambert X. Curing of dicyandiamide epoxy resins accelerated with substituted ureas [J]. Journal of Applied Polymer Science, 1998, 69: 2487-2497
[10]	Pfitzmann A, Fischer A, Fryauf K. Curing of epoxy resins by dicyandiamide [J]. Polymer Bulletin, 1992, 27: 557-564
[11]	Hayaty M, Honarkar H, Beheshty M H. Curing behavior of dicyandiamide/epoxy resin system using different accelerators [J]. Iran.Polym. J., 2013, 22: 591-598
[12]	Yamad T, Okumoto T, Ohtani H, Tsuge S. Characterization of epoxy resins cured with dicyandiamide in the presence of imidazole catalysts by high-resolution pyrolysis-gas chromatography[J]. Journal of Analytical and Applied Pyrolysis, 1995, 33: 157-166
[13]	Gaukler J C. Oligomer formation in epoxy-dicyandiamide systems [J]. The Journal of Adhesion, 2012, 88: 720-750
[14]	Wang Rumin(王汝敏), Zheng Shuirong(郑水蓉), Zeng Zhaozhi(曾昭智). Study on epoxy resin cured with modified dicyandiamide (MDC-1) [J]. Fiber Reinforced Plastics/Composites(玻璃钢/复合材料), 2000 (1): 16-22
[15]	Leon P O, Kaneez Z H, Helen B, Neil J, Andrew N C. Characterization of the biocide polyhexamethylene biguanide by matrix-assisted laser desorption ionization time-of-flight mass spectrometry[J]. Journal of Applied Polymer Science, 2006(102): 4928-4936
[16]	Chen Lianxi(陈连喜), Zhang Huiling(张惠玲), Liu Quanwen(刘全文), Lei Jiaheng(雷家珩). Syntheses of curing agent modified dicyandiamide by m-toluidine [J]. Journal of Wuhan University of Technology(武汉理工大学学报), 2005, 27(8): 11-13
[17]	Zhang Yumei, Jiang Jianming, Chen Yanmo. Synthesis and antimicrobial activity of polymeric guanidine and biguanidine salts[J]. Polymer, 1999, 40: 6189-6198
[18]	Du Xiaodi(杜小弟). Study on the mechanism of the synthesis of phenyl-biguanide and the kinetics of curing epoxy [D]. Wuhan: Wuhan University of Technology, 2007:31-53
[19]	Chen Lianxi(陈连喜), Zhang Huiling(张惠玲), Liu Quanwen(刘全文), Wang Jun(王钧). Characteristic of curing reaction of epoxy resin with dicyandiamide modified by aromatic amines [J]. J. Wuhan Univ.:Nat. Sci. Ed.(武汉大学学报:理学版), 2006, 52(4):426-430
[20]	Chen Sufeng(陈苏锋), Shi Tiejun(史铁钧), Yang Zhaopan(杨兆攀), Tan Dexin(谭德新). Synthesis, characterization and non-isothermal curing kinetics of tri-propargyl isocyanurate [J]. CIESC Journal(化工学报), 2012, 63(7): 2085-2091
[21]	Yang Zhaopan(杨兆攀), Shi Tiejun(史铁钧), Tan Dexin(谭德新). Synthesis of dipropargyl ether of bisphenol A and thermal degradation kinetics of its polymer[J]. CIESC Journal(化工学报), 2011, 62(12): 3554-3559
[22]	Chen Lianxi, Tian Hua, Liu Quanwen, Wang Jun. Curing reaction kinetics of epoxy resin using dicyandiamide modified by aromatic amines [J]. Wuhan University Journal of Natural Sciences, 2007, 12(6): 1105-1108
[23]	Qian Yuchun(钱玉春), Chen Shuanfa(陈拴发), Cong Peiliang(丛培良), Li Zuzhong(李祖仲). Curing kinetical characteristics of epoxy resin system[J]. Journal of Zhengzhou University: Engineering Science (郑州大学学报:工学版), 2012, 33(3): 95-98

聚双胍/环氧树脂体系潜伏性固化过程

Latent curing of polybiguanide/epoxy resin

PDF (PC)

可视化

被引次数

摘要/Abstract

引用本文

使用本文

参考文献 23

相关文章 15

编辑推荐

Metrics

本文评价

[1]	金正浩, 封立杰, 李舒宏. 氨水溶液交叉型再吸收式热泵的能量及分析[J]. 化工学报, 2023, 74(S1): 53-63.
[2]	程成, 段钟弟, 孙浩然, 胡海涛, 薛鸿祥. 表面微结构对析晶沉积特性影响的格子Boltzmann模拟[J]. 化工学报, 2023, 74(S1): 74-86.
[3]	肖明堃, 杨光, 黄永华, 吴静怡. 浸没孔液氧气泡动力学数值研究[J]. 化工学报, 2023, 74(S1): 87-95.
[4]	毕丽森, 刘斌, 胡恒祥, 曾涛, 李卓睿, 宋健飞, 吴翰铭. 粗糙界面上纳米液滴蒸发模式的分子动力学研究[J]. 化工学报, 2023, 74(S1): 172-178.
[5]	江河, 袁俊飞, 王林, 邢谷雨. 均流腔结构对微细通道内相变流动特性影响的实验研究[J]. 化工学报, 2023, 74(S1): 235-244.
[6]	王琪, 张斌, 张晓昕, 武虎建, 战海涛, 王涛. 氯铝酸-三乙胺离子液体/P₂O₅催化合成伊索克酸和2-乙基蒽醌[J]. 化工学报, 2023, 74(S1): 245-249.
[7]	于宏鑫, 邵双全. 水结晶过程的分子动力学模拟分析[J]. 化工学报, 2023, 74(S1): 250-258.
[8]	范孝雄, 郝丽芳, 范垂钢, 李松庚. LaMnO₃/生物炭催化剂低温NH₃-SCR催化脱硝性能研究[J]. 化工学报, 2023, 74(9): 3821-3830.
[9]	郑佳丽, 李志会, 赵新强, 王延吉. 离子液体催化合成2-氰基呋喃反应动力学研究[J]. 化工学报, 2023, 74(9): 3708-3715.
[10]	孟令玎, 崇汝青, 孙菲雪, 孟子晖, 刘文芳. 改性聚乙烯膜和氧化硅固定化碳酸酐酶[J]. 化工学报, 2023, 74(8): 3472-3484.
[11]	汪林正, 陆俞冰, 张睿智, 罗永浩. 基于分子动力学模拟的VOCs热氧化特性分析[J]. 化工学报, 2023, 74(8): 3242-3255.
[12]	曾如宾, 沈中杰, 梁钦锋, 许建良, 代正华, 刘海峰. 基于分子动力学模拟的Fe₂O₃纳米颗粒烧结机制研究[J]. 化工学报, 2023, 74(8): 3353-3365.
[13]	李锦潼, 邱顺, 孙文寿. 煤浆法烟气脱硫中草酸和紫外线强化煤砷浸出过程[J]. 化工学报, 2023, 74(8): 3522-3532.
[14]	郑玉圆, 葛志伟, 韩翔宇, 王亮, 陈海生. 中高温钙基材料热化学储热的研究进展与展望[J]. 化工学报, 2023, 74(8): 3171-3192.
[15]	杨菲菲, 赵世熙, 周维, 倪中海. Sn掺杂的In₂O₃催化CO₂选择性加氢制甲醇[J]. 化工学报, 2023, 74(8): 3366-3374.